Detail publikačního výsledku

Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

NICÁK, M.; ŠVECOVÁ, O.; ŠANDERA, J.; PULEC, J.; SZENDIUCH, I.

Originální název

Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

Anglický název

Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

Anglický abstrakt

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

Klíčová slova

3D Packaging, ANSYS, Lead-free, Reliability, Solder joint

Klíčová slova v angličtině

3D Packaging, ANSYS, Lead-free, Reliability, Solder joint

Autoři

NICÁK, M.; ŠVECOVÁ, O.; ŠANDERA, J.; PULEC, J.; SZENDIUCH, I.

Rok RIV

2011

Vydáno

12.01.2011

Nakladatel

Trans Tech Publications

Místo

Švýcarsko

ISBN

978-3-03785-006-0

Kniha

Key Engineering Materials Vol. 465 (2011)

ISSN

1013-9826

Periodikum

Key Engineering Materials (print)

Svazek

465

Číslo

491

Stát

Švýcarská konfederace

Strany od

491

Strany do

494

Strany počet

4

URL

http://www.scientific.net/KEM.465.491

BibTex

@inproceedings{BUT36015,
  author="Michal {Nicák} and Olga {Švecová} and Josef {Šandera} and Jiří {Pulec} and Ivan {Szendiuch}",
  title="Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure",
  booktitle="Key Engineering Materials Vol. 465 (2011)",
  year="2011",
  journal="Key Engineering Materials (print)",
  volume="465",
  number="491",
  pages="491--494",
  publisher="Trans Tech Publications",
  address="Švýcarsko",
  isbn="978-3-03785-006-0",
  issn="1013-9826",
  url="http://www.scientific.net/KEM.465.491"
}