Detail publikačního výsledku

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

NICÁK, M.; SZENDIUCH, I.

Originální název

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

Anglický název

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.

Anglický abstrakt

This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.

Klíčová slova

packaging, stacking, 3D structures, lead-free, thick-film

Klíčová slova v angličtině

packaging, stacking, 3D structures, lead-free, thick-film

Autoři

NICÁK, M.; SZENDIUCH, I.

Rok RIV

2011

Vydáno

22.04.2010

Nakladatel

Publishing House of ISTU

Místo

Izhevsk, Russia

ISBN

978-5-7526-0442-3

Kniha

Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings

Strany od

378

Strany do

382

Strany počet

444

BibTex

@inproceedings{BUT33965,
  author="Michal {Nicák} and Ivan {Szendiuch}",
  title="CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES",
  booktitle="Second Forum of Young Researchers. In the framework of International Forum {"}Education Quality - 2010{"} : Proceedings",
  year="2010",
  pages="378--382",
  publisher="Publishing House of ISTU",
  address="Izhevsk, Russia",
  isbn="978-5-7526-0442-3"
}