Detail publikačního výsledku

The students' workplace for special components soldering and inspection

ADÁMEK, M.; PRÁŠEK, J.; NICÁK, M.

Originální název

The students' workplace for special components soldering and inspection

Anglický název

The students' workplace for special components soldering and inspection

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

Expansion of microelectronics technologies is very fast. An education on high schools and universities must be conformed to these new trends and new technologies, which are a base for new education methods. This paper is focused to the problematic of interconnections and the implementation of new trends of modern soldering technologies and modern equipment into education process; concretely in courses, which are specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and soldering of BGA components using own prepared samples are presented. Samples are made from ceramic and organic materials. The solder paste was deposited to the samples by stencil printing techniques and samples were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection was made by optical inspection device Ersascope. Finally it was found that this process is suitable for practical education.

Anglický abstrakt

Expansion of microelectronics technologies is very fast. An education on high schools and universities must be conformed to these new trends and new technologies, which are a base for new education methods. This paper is focused to the problematic of interconnections and the implementation of new trends of modern soldering technologies and modern equipment into education process; concretely in courses, which are specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and soldering of BGA components using own prepared samples are presented. Samples are made from ceramic and organic materials. The solder paste was deposited to the samples by stencil printing techniques and samples were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection was made by optical inspection device Ersascope. Finally it was found that this process is suitable for practical education.

Klíčová slova

education, BGA, soldering, 3-D packaging

Klíčová slova v angličtině

education, BGA, soldering, 3-D packaging

Autoři

ADÁMEK, M.; PRÁŠEK, J.; NICÁK, M.

Rok RIV

2011

Vydáno

02.09.2009

Nakladatel

NOVPRESS s.r.o.

Místo

Brno

ISBN

978-80-214-3933-7

Kniha

EDS '09 IMAPS CS International Conference Proceedings

Strany od

392

Strany do

396

Strany počet

5

BibTex

@inproceedings{BUT29593,
  author="Martin {Adámek} and Jan {Prášek} and Michal {Nicák}",
  title="The students' workplace for special components soldering and inspection",
  booktitle="EDS '09 IMAPS CS International Conference Proceedings",
  year="2009",
  pages="392--396",
  publisher="NOVPRESS s.r.o.",
  address="Brno",
  isbn="978-80-214-3933-7"
}