Detail publikačního výsledku

Thermomechanical Reliability of LF Solder SAC305 in SMT Chip Assembly

ŠANDERA, J.

Originální název

Thermomechanical Reliability of LF Solder SAC305 in SMT Chip Assembly

Anglický název

Thermomechanical Reliability of LF Solder SAC305 in SMT Chip Assembly

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper focuses on the practical measurement of the reliability of the LF solder SAC305 connection SMT chip mounted component size 2512 on PCB with various surface finishing. It is HAL, immerse tin, galvanic gold. Reliabikity was terminated after temperature cycles +100C to 0C.

Anglický abstrakt

This paper focuses on the practical measurement of the reliability of the LF solder SAC305 connection SMT chip mounted component size 2512 on PCB with various surface finishing. It is HAL, immerse tin, galvanic gold. Reliabikity was terminated after temperature cycles +100C to 0C.

Klíčová slova

LF solder SAC305, Chip Components 2512, HAL, Immerse Tin, Galvanic gold

Klíčová slova v angličtině

LF solder SAC305, Chip Components 2512, HAL, Immerse Tin, Galvanic gold

Autoři

ŠANDERA, J.

Vydáno

20.09.2007

Nakladatel

Zdeněk Novotný

Místo

Brno, 2007

ISBN

978-80-214-3470-7

Kniha

Electronic Devices and Systems, EDS 07, IMAPS CS International Conference 2007, Proceedings

Strany od

276

Strany do

279

Strany počet

4

BibTex

@inproceedings{BUT28860,
  author="Josef {Šandera}",
  title="Thermomechanical Reliability of LF Solder SAC305 in SMT Chip Assembly",
  booktitle="Electronic Devices and Systems, EDS 07, IMAPS CS International Conference 2007, Proceedings",
  year="2007",
  number="1",
  pages="276--279",
  publisher="Zdeněk Novotný",
  address="Brno, 2007",
  isbn="978-80-214-3470-7"
}