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Detail publikačního výsledku
TOFEL, P.; SEDLÁKOVÁ, V.; ŠIKULA, J.
Originální název
Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal
Anglický název
Druh
Stať ve sborníku v databázi WoS či Scopus
Originální abstrakt
The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005 to 1 , which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator
Anglický abstrakt
Klíčová slova
Elektro-Ultrasonic, rezistive change, DC voltage
Klíčová slova v angličtině
Autoři
Rok RIV
2010
Vydáno
07.05.2008
Místo
Hungary
ISBN
978-963-06-4915-5
Kniha
Reliability and Life-time Prediction ISSE2008
Edice
1
Strany od
56
Strany do
57
Strany počet
2
BibTex
@inproceedings{BUT26554, author="Pavel {Tofel} and Vlasta {Sedláková} and Josef {Šikula}", title="Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal", booktitle="Reliability and Life-time Prediction ISSE2008", year="2008", series="1", number="1", pages="56--57", address="Hungary", isbn="978-963-06-4915-5" }