Detail publikačního výsledku

Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages

BĚHUNEK, I.; FIALA, P.

Originální název

Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages

Anglický název

Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

Anglický abstrakt

This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

Klíčová slova

FEM, ANSYS, phase change, cooling, thermal management

Klíčová slova v angličtině

FEM, ANSYS, phase change, cooling, thermal management

Autoři

BĚHUNEK, I.; FIALA, P.

Vydáno

05.10.2007

Místo

Lednice

ISBN

978-80-254-0301-3

Kniha

15. Ansys Users Meeting

Strany od

1

Strany do

12

Strany počet

12

BibTex

@inproceedings{BUT25600,
  author="Ivo {Běhunek} and Pavel {Fiala}",
  title="Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages",
  booktitle="15. Ansys Users Meeting",
  year="2007",
  pages="1--12",
  address="Lednice",
  isbn="978-80-254-0301-3"
}