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MARWAN, S.; ABUAMR, A.; ALSOUD, A.; KNÁPEK, A.; SOBOLA, D.
Originální název
Characterization and Analysis of Field Electron Emission from Copper Tips
Anglický název
Druh
Stať ve sborníku v databázi WoS či Scopus
Originální abstrakt
In the present investigation, field electron emission (FEE) from high-purity copper emitters has been studied under vacuum conditions of approximately 10(-5) mbar. This research aimed to study the emission properties of copper under low-pressure environments, which is essential for applications in fields such as electron microscopy and vacuum electronics. The current-voltage (I-V) characteristics are analyzed utilizing Murphy-Good (MG) method plots in this study. In addition, a Scanning Electron Microscope with Energy-Dispersive X-ray Spectroscopy (SEM-EDS) was used to visualize the surface of the emitters and analyze sample purity. The spatial distribution of electron emission and current stability were obtained as well to analyze electron emission behavior from the surface of the tips. Electron mapping demonstrated a consistent component distribution throughout the copper tips, showing uniformity in their composition. The current-voltage characteristics showed a notable switching phenomenon that is explained by the existence of a thin oxide layer formed on the emitter's surfaces. This thin oxide layer provides additional quantum barrier for the surface.
Anglický abstrakt
Klíčová slova
field electron emission, copper emitters,vacuum electronics
Klíčová slova v angličtině
Autoři
Rok RIV
2026
Vydáno
01.01.2024
Nakladatel
IEEE
Místo
NEW YORK
ISBN
979-8-3503-7977-8
Kniha
International Vacuum Nanoelectronics Conference
Strany počet
2
BibTex
@inproceedings{BUT201104, author="{} and {} and Ammar Awadallah Ahmad {Alsoud} and Alexandr {Knápek} and Dinara {Sobola}", title="Characterization and Analysis of Field Electron Emission from Copper Tips", booktitle="International Vacuum Nanoelectronics Conference", year="2024", pages="2", publisher="IEEE", address="NEW YORK", doi="10.1109/IVNC63480.2024.10652547", isbn="979-8-3503-7977-8" }