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Detail publikačního výsledku
MACAIA, A.; NARAYAN, N.; SHUKLA, R.; CHANDRA, A.; ZELENÝ, O.; ZÁVORKA, R.; BLUMENSTEIN, J.; PROKEŠ, A.; WOJTUŃ, J.; KELNER, J.; ZIÓŁKOWSKI, C.
Originální název
Framework for Indoor Wireless Propagation Modeling through Wireless Insite®
Anglický název
Druh
Stať ve sborníku v databázi WoS či Scopus
Originální abstrakt
Multipaths, reflections, diffractions, and material interactions complicate indoor wireless propagation modelling. More than 80% of wireless data is consumed indoors; hence, planning successful deployments and maximizing network performance depends on accurate propagation modelling of indoor environments. This work explains a complete framework for indoor wireless propagation modelling via ray tracing simulation in a step-by-step manner. The ray tracing simulations are conducted with Wireless Insite (R), a proprietary electromagnetic propagation software, whereas SketchUp (R) is used at the input side for layout construction from the field measurements, and MATLAB (R) is used at the output side for portraying channel model parameters such as power delay profile (PDP). A whole floor of the authors' department is modelled, and different transmitter-receiver locations were tested for possible use cases such as coverage hole prediction.
Anglický abstrakt
Klíčová slova
Ray tracing, power delay profile, coverage hole prediction
Klíčová slova v angličtině
Autoři
Rok RIV
2026
Vydáno
23.05.2025
Nakladatel
IEEE
Místo
NEW YORK
ISBN
979-8-3315-4447-8
Kniha
International Conference on Radioelektronika
Strany od
1
Strany do
6
Strany počet
URL
https://ieeexplore.ieee.org/abstract/document/11008377
BibTex
@inproceedings{BUT199779, author="{} and {} and Rajeev {Shukla} and Aniruddha {Chandra} and Ondřej {Zelený} and Radek {Závorka} and Jiří {Blumenstein} and Aleš {Prokeš} and Jarosław {Wojtuń} and Jan M. {Kelner} and Cezary {Ziółkowski}", title="Framework for Indoor Wireless Propagation Modeling through Wireless Insite®", booktitle="International Conference on Radioelektronika", year="2025", pages="1--6", publisher="IEEE", address="NEW YORK", doi="10.1109/RADIOELEKTRONIKA65656.2025.11008377", isbn="979-8-3315-4447-8", url="https://ieeexplore.ieee.org/abstract/document/11008377" }