Detail publikačního výsledku

Comparing of flip-chip and wire-bonding interconnection

Novotný M.,Jakubka L.,Szendiuch I.

Originální název

Comparing of flip-chip and wire-bonding interconnection

Anglický název

Comparing of flip-chip and wire-bonding interconnection

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.

Anglický abstrakt

This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.

Klíčová slova

flip chip, wire bonding, ANSYS, termomechanical stress

Klíčová slova v angličtině

flip chip, wire bonding, ANSYS, termomechanical stress

Autoři

Novotný M.,Jakubka L.,Szendiuch I.

Vydáno

01.01.2006

Nakladatel

TU Dresden

Místo

Dresden

ISBN

00-000-0000-0

Kniha

29th International Spring Seminar on Electronics Technology, ISSE 2006

Strany od

67

Strany počet

4

BibTex

@inproceedings{BUT18686,
  author="Marek {Novotný} and Luboš {Jakubka} and Ivan {Szendiuch}",
  title="Comparing of flip-chip and wire-bonding interconnection",
  booktitle="29th International Spring Seminar on Electronics Technology, ISSE 2006",
  year="2006",
  number="prvni",
  pages="4",
  publisher="TU Dresden",
  address="Dresden",
  isbn="00-000-0000-0"
}