Detail publikačního výsledku

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

BULVA, J., NOVOTNÝ, M., SZENDIUCH, I.

Originální název

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

Anglický název

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

Anglický abstrakt

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

Klíčová slova v angličtině

ANSYS, modelling, reliability, Lead-free

Autoři

BULVA, J., NOVOTNÝ, M., SZENDIUCH, I.

Vydáno

01.01.2005

Nakladatel

IMAPS BENELUX

Místo

Brugge, Belgium

Kniha

15th European Microelectronics and Packaging Conference & Exhibition

Strany od

546

Strany počet

550

BibTex

@inproceedings{BUT14828,
  author="Jindřich {Bulva} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling",
  booktitle="15th European Microelectronics and Packaging Conference & Exhibition",
  year="2005",
  pages="550",
  publisher="IMAPS BENELUX",
  address="Brugge, Belgium"
}