Detail publikačního výsledku

ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS

VALA, R.; TOUFAR, M.

Originální název

ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS

Anglický název

ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.

Anglický abstrakt

This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.

Klíčová slova

BGA, flux, solder, repair

Klíčová slova v angličtině

BGA, flux, solder, repair

Autoři

VALA, R.; TOUFAR, M.

Rok RIV

2017

Vydáno

28.04.2016

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Místo

Brno

ISBN

978-80-214-5350-0

Kniha

Proceedings of the 22nd Conference Student EEICT 2016

Strany od

203

Strany do

205

Strany počet

777

BibTex

@inproceedings{BUT127136,
  author="Radek {Vala} and Michal {Toufar}",
  title="ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS",
  booktitle="Proceedings of the 22nd Conference Student EEICT 2016",
  year="2016",
  pages="203--205",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5350-0"
}