Publication result detail

Influence of Electric Current at Solidification of Solder

OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.

Original Title

Influence of Electric Current at Solidification of Solder

English Title

Influence of Electric Current at Solidification of Solder

Type

Paper in proceedings (conference paper)

Original Abstract

This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscopy.

English abstract

This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscopy.

Keywords

scanning electron microscopy, soldering, solders solidification,

Key words in English

scanning electron microscopy, soldering, solders solidification,

Authors

OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.

RIV year

2020

Released

26.08.2019

Publisher

IEEE

Book

42nd International Spring Seminar on Electronics Technology (ISSE).

ISBN

2161-2528

Periodical

Conference proceedings (International Spring Seminar on Electronics Technology)

State

United States of America

Pages from

1

Pages to

5

Pages count

5

URL

BibTex

@inproceedings{BUT161228,
  author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch}",
  title="Influence of Electric Current at Solidification of Solder",
  booktitle="42nd International Spring Seminar on Electronics Technology (ISSE).",
  year="2019",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  pages="1--5",
  publisher="IEEE",
  doi="10.1109/ISSE.2019.8810308",
  issn="2161-2528",
  url="https://ieeexplore.ieee.org/document/8810308"
}