Detail publikačního výsledku

Optical method for validation of changes in the cleaning process and cleaning process optimization

SITKO, V.; SZENDIUCH, I.

Originální název

Optical method for validation of changes in the cleaning process and cleaning process optimization

Anglický název

Optical method for validation of changes in the cleaning process and cleaning process optimization

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

Currently, electronic assemblies are more complex and compact. Requirements on the reliability of electronic assemblies in a harsh environment are rapidly growing. Assemblies become dense, with small distances between poles. Processing of low and very high-frequency signals requires high values of surface insulation. Experiences confirm that using No-clean soldering technology has only limited efficiency in protection against leakage current, ion migration, and corrosion.

Anglický abstrakt

Currently, electronic assemblies are more complex and compact. Requirements on the reliability of electronic assemblies in a harsh environment are rapidly growing. Assemblies become dense, with small distances between poles. Processing of low and very high-frequency signals requires high values of surface insulation. Experiences confirm that using No-clean soldering technology has only limited efficiency in protection against leakage current, ion migration, and corrosion.

Klíčová slova

cleaning, PCB, environment protection, electronic manufacturing

Klíčová slova v angličtině

cleaning, PCB, environment protection, electronic manufacturing

Autoři

SITKO, V.; SZENDIUCH, I.

Rok RIV

2021

Vydáno

19.09.2019

Nakladatel

IMAPS Europe

Místo

Pisa

ISBN

978-0-9568086-6-0

Kniha

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Edice

1

Strany od

1

Strany do

8

Strany počet

8

URL

https://ieeexplore.ieee.org/document/8951759

BibTex

@inproceedings{BUT161201,
  author="SITKO, V. and SZENDIUCH, I.",
  title="Optical method for validation of changes in the cleaning process and cleaning process optimization",
  booktitle="2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)",
  year="2019",
  series="1",
  number="1",
  pages="1--8",
  publisher="IMAPS Europe",
  address="Pisa",
  doi="10.23919/EMPC44848.2019.8951759",
  isbn="978-0-9568086-6-0",
  url="https://ieeexplore.ieee.org/document/8951759"
}