Publication detail

Optical method for validation of changes in the cleaning process and cleaning process optimization

SITKO, V. SZENDIUCH, I.

Original Title

Optical method for validation of changes in the cleaning process and cleaning process optimization

Type

conference paper

Language

English

Original Abstract

Currently, electronic assemblies are more complex and compact. Requirements on the reliability of electronic assemblies in a harsh environment are rapidly growing. Assemblies become dense, with small distances between poles. Processing of low and very high-frequency signals requires high values of surface insulation. Experiences confirm that using No-clean soldering technology has only limited efficiency in protection against leakage current, ion migration, and corrosion.

Keywords

cleaning, PCB, environment protection, electronic manufacturing

Authors

SITKO, V.; SZENDIUCH, I.

Released

19. 9. 2019

Publisher

IMAPS Europe

Location

Pisa

ISBN

978-0-9568086-6-0

Book

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Edition

1

Edition number

1

Pages from

1

Pages to

8

Pages count

8

URL

https://ieeexplore.ieee.org/document/8951759

BibTex

@inproceedings{BUT161201,
  author="SITKO, V. and SZENDIUCH, I.",
  title="Optical method for validation of changes in the cleaning process and cleaning process optimization",
  booktitle="2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)",
  year="2019",
  series="1",
  number="1",
  pages="1--8",
  publisher="IMAPS Europe",
  address="Pisa",
  doi="10.23919/EMPC44848.2019.8951759",
  isbn="978-0-9568086-6-0",
  url="https://ieeexplore.ieee.org/document/8951759"
}