Publication result detail

Three ways to ceramic packages

SKÁCEL, J.; SZENDIUCH, I.

Original Title

Three ways to ceramic packages

English Title

Three ways to ceramic packages

Type

Paper in proceedings (conference paper)

Original Abstract

This paper is focused on ceramic packaging primarily on the technology of creation. The first part is about ceramic packages and aluminium oxide in general. This paper shows three technologies of ceramic package creation. The first one is ceramic powder pressing. The second one is high temperature co-fired ceramic. The third one is ceramic mold casting. The paper describes issues of creation and shows inspection with a figure from scanning electron microscope. The last part is focused on thick film printing and finalization of the ceramic package.

English abstract

This paper is focused on ceramic packaging primarily on the technology of creation. The first part is about ceramic packages and aluminium oxide in general. This paper shows three technologies of ceramic package creation. The first one is ceramic powder pressing. The second one is high temperature co-fired ceramic. The third one is ceramic mold casting. The paper describes issues of creation and shows inspection with a figure from scanning electron microscope. The last part is focused on thick film printing and finalization of the ceramic package.

Keywords

Ceramics, Powders, Aluminum oxide, Pressing

Key words in English

Ceramics, Powders, Aluminum oxide, Pressing

Authors

SKÁCEL, J.; SZENDIUCH, I.

RIV year

2018

Released

08.08.2017

Publisher

IEEE Computer Society

Location

Sofia, Bulgaria

ISBN

978-1-5386-0582-0

Book

Electronics Technology (ISSE), 2017 40th International Spring Seminar on

Edition

Volume 2017-September

ISBN

2161-2536

Periodical

Conference proceedings (International Spring Seminar on Electronics Technology)

Volume

1

Number

1

State

United States of America

Pages from

249

Pages to

254

Pages count

4

URL

http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919

BibTex

@inproceedings{BUT138532,
  author="Josef {Skácel} and Ivan {Szendiuch}",
  title="Three ways to ceramic packages",
  booktitle="Electronics Technology (ISSE), 2017 40th International Spring Seminar on",
  year="2017",
  series="Volume 2017-September",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  volume="1",
  number="1",
  pages="249--254",
  publisher="IEEE Computer Society",
  address="Sofia, Bulgaria",
  doi="10.1109/ISSE.2017.8000919",
  isbn="978-1-5386-0582-0",
  url="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919"
}