Detail publikace

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY

RIHÁK, P.

Originální název

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The paper deals with the detection of defects using X-ray technology. It is focused on a particular type of X-ray machine, which is used for most of these experiments. X-ray cabinet is commonly used for analyzes of defects, which are formed during soldering process. Paper also includes an introduction of different types of defects. These defects are serious issue and they can cause malfunction of infected components or of the entire device. That is the main reason it is so important to focus on this issue.

Klíčová slova

DPS, BGA, defect, X-ray, detection

Autoři

RIHÁK, P.

Rok RIV

2015

Vydáno

23. 4. 2015

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Místo

Brno

ISBN

978-80-214-5148-3

Kniha

Proceedings of the 21st Conference STUDENT EEICT 2015

Číslo edice

1

ISSN

NEUVEDENO

Strany od

391

Strany do

395

Strany počet

5

BibTex

@inproceedings{BUT114356,
  author="Pavel {Řihák}",
  title="DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015",
  year="2015",
  number="1",
  pages="391--395",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  address="Brno",
  isbn="978-80-214-5148-3"
}