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RIHÁK, P.
Original Title
DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY
English Title
Type
Paper in proceedings (conference paper)
Original Abstract
The paper deals with the detection of defects using X-ray technology. It is focused on a particular type of X-ray machine, which is used for most of these experiments. X-ray cabinet is commonly used for analyzes of defects, which are formed during soldering process. Paper also includes an introduction of different types of defects. These defects are serious issue and they can cause malfunction of infected components or of the entire device. That is the main reason it is so important to focus on this issue.
English abstract
Keywords
DPS, BGA, defect, X-ray, detection
Key words in English
Authors
RIV year
2016
Released
23.04.2015
Publisher
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních
Location
Brno
ISBN
978-80-214-5148-3
Book
Proceedings of the 21st Conference STUDENT EEICT 2015
NEUVEDENO
Pages from
391
Pages to
395
Pages count
5
BibTex
@inproceedings{BUT114356, author="Pavel {Řihák}", title="DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY", booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015", year="2015", number="1", pages="391--395", publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních", address="Brno", isbn="978-80-214-5148-3" }