Detail publikace

Textile microwave substrates: Special types of 3D knitted materials

KRÁČALOVÁ, D. PROCHÁZKA, J. LÉDROVÁ, Z. RAIDA, Z. LÁČÍK, J. DŘÍNOVSKÝ, J. CUPAL, M.

Originální název

Textile microwave substrates: Special types of 3D knitted materials

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The paper summarizes the experience with the development, production and optimization of 3D fabrics, specifically 3D weft knitted fabrics, planned for the integration of electronic components. Attention is focused on the presentation of 3D fabrics general properties which are given by their structure, used materials and finishing. The technological possibilities of preparation of this type of fabrics are summarized and their limits are described in detail and possible application areas are outlined. The possibilities of surface treatment from coating, lamination to printing or embossing are presented in order to optimize the fabric surface for a given application.

Klíčová slova

3D fabric; 3D weft knitted fabric; spacer fabric; distance fabric; technical fabric; functional fabric; antistatic fabric; textile substrate

Autoři

KRÁČALOVÁ, D.; PROCHÁZKA, J.; LÉDROVÁ, Z.; RAIDA, Z.; LÁČÍK, J.; DŘÍNOVSKÝ, J.; CUPAL, M.

Vydáno

16. 11. 2020

Nakladatel

IEEE

Místo

NEW YORK

ISBN

978-83-949421-7-5

Kniha

2020 23rd International Microwave and Radar Conference (MIKON)

Strany od

237

Strany do

240

Strany počet

4

URL

https://ieeexplore.ieee.org/abstract/document/9253942

BibTex

@inproceedings{BUT177235,
  author="Dita {Kráčalová} and Jiří {Procházka} and Zdeňka {Lédrová} and Zbyněk {Raida} and Jaroslav {Láčík} and Jiří {Dřínovský} and Miroslav {Cupal}",
  title="Textile microwave substrates: Special types of 3D knitted materials",
  booktitle="2020 23rd International Microwave and Radar Conference (MIKON)",
  year="2020",
  pages="237--240",
  publisher="IEEE",
  address="NEW YORK",
  doi="10.23919/MIKON48703.2020.9253942",
  isbn="978-83-949421-7-5",
  url="https://ieeexplore.ieee.org/abstract/document/9253942"
}