Detail publikace

Electromigration and Flux Residues.

STARÝ, J.

Originální název

Electromigration and Flux Residues.

Typ

článek ve sborníku mimo WoS a Scopus

Jazyk

angličtina

Originální abstrakt

Assembly and interconnection structures and assemblies are characterized by a larger proportion of HDI structures (line/space < 100 m), higher component density, a wide range of materials used and with a frequent absence of cleaning procedures after mass soldering and nonhermetic packages. On the electro-insulating surfaces, both atoms and molecules of flux residues and molecules of the polar liquid forming the electrolyte (most often water) are adsorbed. The interaction of metal materials with the polar environment and the ensuing electrical voltage is associated with chemical reactions and subsequent surface and volume diffusion. The acceleration of these electrochemical reactions is helped by higher working temperatures, higher humidity, size and frequency of electrical voltage between conductors. The result is often so-called electromigration, which is associated with the reduction of surface insulation resistance, corrosion, dendrite/fiber growth and the formation of subsequent short circuits.

Klíčová slova

Electromigration, Flux Residues

Autoři

STARÝ, J.

Vydáno

25. 8. 2021

Nakladatel

ABAF

Místo

Brno

Strany od

250

Strany do

252

Strany počet

3

BibTex

@inproceedings{BUT172953,
  author="Jiří {Starý}",
  title="Electromigration and Flux Residues.",
  year="2021",
  pages="250--252",
  publisher="ABAF",
  address="Brno"
}