Detail publikace

Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

OTÁHAL, A. SKÁCEL, J. SZENDIUCH, I. BÚRAN, M.

Originální název

Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding and polishing with diamond paste with a grain size up to 0.25 μm. The second method is the microsection of the BGA (ball grid array) ball using FIB (focused ion beam) technology. Both technologies contain disadvantages in examining the detail of the solder structure. Scratches are a common problem for grinding and polishing which are caused by the smallest grain in the polishing paste. The FIB technology is designed for a smaller sample rather than a BGA ball. Using this technology, the curtain can be caused by an ion beam. This research is mainly concerned with the comparison of these technologies with emphasis on the possibility of losing information when processing samples.

Klíčová slova

ball grid arrays, focused ion beam technology, grain size, grinding, metallography, polishing, solders

Autoři

OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; BÚRAN, M.

Vydáno

1. 7. 2021

Nakladatel

IEEE

ISBN

978-1-6654-1477-7

Kniha

2021 44th International Spring Seminar on Electronics Technology (ISSE)

ISSN

2161-2536

Periodikum

International Spring Seminar on Electronics Technology ISSE

Ročník

44

Číslo

1

Stát

Spojené státy americké

Strany od

1

Strany do

6

Strany počet

6

URL

https://ieeexplore.ieee.org/document/9467519

BibTex

@inproceedings{BUT172578,
  author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch} and Martin {Búran}",
  title="Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure",
  booktitle="2021 44th International Spring Seminar on Electronics Technology (ISSE)",
  year="2021",
  journal="International Spring Seminar on Electronics Technology ISSE",
  volume="44",
  number="1",
  pages="1--6",
  publisher="IEEE",
  doi="10.1109/ISSE51996.2021.9467626",
  isbn="978-1-6654-1477-7",
  issn="2161-2536",
  url="https://ieeexplore.ieee.org/document/9467519"
}