Detail publikace

Effect of temperature cycling on IMC growth and solder joint strength of SAC305 solder alloy and REL61 low silver alloy

DOKOUPIL, J. STARÝ, J.

Originální název

Effect of temperature cycling on IMC growth and solder joint strength of SAC305 solder alloy and REL61 low silver alloy

Typ

článek ve sborníku mimo WoS a Scopus

Jazyk

angličtina

Originální abstrakt

This work deals with the comparison of the standard SAC305 (Sn 96,5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during temperature cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. Also, the mechanical strength of the solder joints in shear was measured. It can be concluded that the IMC growth on samples temperature cycled according the TC1 did not exceed the critical limit where the solder joint would be weakened for both alloys. For the samples temperature cycled according TC2 the IMC growth were lower in compare with samples cycled according TC1 but the impact on the shear strength is higher. It was also found that REL61 alloy achieved higher shear strength of the solder joint than SAC305 alloy. From the above findings, it can be concluded that in terms of the growth of the IMC layer under thermal stress and its effect on the shear strength of the solder joint, the REL61 solder alloy can be used as a replacement for SAC305.

Klíčová slova

SAC305, REL61, IMC, temperature cycling, shear strength

Autoři

DOKOUPIL, J.; STARÝ, J.

Vydáno

23. 8. 2021

Nakladatel

Brno University of Technology

Místo

Brno, CZ

ISBN

978-80-214-5975-5

Kniha

Advanced Batteries Accumulators and Fuel Cells – 22nd ABAF

Edice

22

Číslo edice

1

Strany od

208

Strany do

209

Strany počet

2

BibTex

@inproceedings{BUT172310,
  author="Jakub {Dokoupil} and Jiří {Starý}",
  title="Effect of temperature cycling on IMC growth and solder joint strength of SAC305 solder alloy and REL61 low silver alloy",
  booktitle="Advanced Batteries Accumulators and Fuel Cells – 22nd ABAF",
  year="2021",
  series="22",
  number="1",
  pages="208--209",
  publisher="Brno University of Technology",
  address="Brno, CZ",
  isbn="978-80-214-5975-5"
}