Detail publikačního výsledku

Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates

ŠEVEČEK, O.; BERMEJO, R.; PROFANT, T.; KOTOUL, M.

Originální název

Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates

Anglický název

Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

The influence of the compressive residual stresses and layer thickness in ceramic laminates on the presence of the crack bifurcation phenomenon is numerically investigated in this contribution. Using the fracture criterion, based on the Finite Fracture Mechanics, the angle and type of crack propagation (single crack deflection/bifurcation) within the layers with large compressive stresses is investigated. Laminates with various thicknesses of the compressive layer and constant level of the compressive residual stresses are used for this purpose. In these cases, the level of the T-stress (in the vicinity of the crack tip) can play a role as a second parameter in the fracture criterion (next to the stress intensity factor) and as a consequence can this term influence the predicted crack propagation behaviour.

Anglický abstrakt

The influence of the compressive residual stresses and layer thickness in ceramic laminates on the presence of the crack bifurcation phenomenon is numerically investigated in this contribution. Using the fracture criterion, based on the Finite Fracture Mechanics, the angle and type of crack propagation (single crack deflection/bifurcation) within the layers with large compressive stresses is investigated. Laminates with various thicknesses of the compressive layer and constant level of the compressive residual stresses are used for this purpose. In these cases, the level of the T-stress (in the vicinity of the crack tip) can play a role as a second parameter in the fracture criterion (next to the stress intensity factor) and as a consequence can this term influence the predicted crack propagation behaviour.

Klíčová slova

Ceramic laminates;T-stress; crack bifurcation; Finite Fracture Mechanics

Klíčová slova v angličtině

Ceramic laminates;T-stress; crack bifurcation; Finite Fracture Mechanics

Autoři

ŠEVEČEK, O.; BERMEJO, R.; PROFANT, T.; KOTOUL, M.

Rok RIV

2015

Vydáno

01.07.2014

Nakladatel

Elsevier

Místo

Trondheim, Norsko

ISBN

9781632669094

Kniha

20th European Conference on Fracture (ECF 2014)

Edice

Procedia Materials Science Volume 3

ISSN

2211-8128

Periodikum

Procedia Materials Science

Svazek

3

Číslo

7

Stát

Nizozemsko

Strany od

1062

Strany do

1067

Strany počet

6

BibTex

@inproceedings{BUT108414,
  author="Oldřich {Ševeček} and Raul {Bermejo} and Tomáš {Profant} and Michal {Kotoul}",
  title="Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates",
  booktitle="20th European Conference on Fracture (ECF 2014)",
  year="2014",
  series="Procedia Materials Science Volume 3",
  journal="Procedia Materials Science",
  volume="3",
  number="7",
  pages="1062--1067",
  publisher="Elsevier",
  address="Trondheim, Norsko",
  doi="10.1016/j.mspro.2014.06.173",
  isbn="9781632669094",
  issn="2211-8128"
}