Detail publikace
Characterization of Thermal Stress of Building Materials Containing Rubber Granulate by Alternating Electric Field
KUSÁK, I. LUŇÁK, M. CHOBOLA, Z. TUPÝ, M. SOTIRIADIS, K.
Originální název
Characterization of Thermal Stress of Building Materials Containing Rubber Granulate by Alternating Electric Field
Anglický název
Characterization of Thermal Stress of Building Materials Containing Rubber Granulate by Alternating Electric Field
Jazyk
en
Originální abstrakt
The present paper deals with the application of impedance spectroscopy method to test cement-based composites after their exposure to high temperatures. A type CEM I Portland cement, siliceous sand and shredded automobile tires were used to prepare mortar specimens. The specimens differentiated in whether or not a 10 % w/w acrylic polymer binder (polymer dispersion 20 % w/w to cement mass) addition to the mortar mixture was used. The specimens were exposed to high temperatures (temperature range: 25-400 degrees of Celsius). Monitoring of structural changes during subjection to thermal stress is an effective way to determine the reliability of specimens structure. Based on Debye's dielectric theory, the specimens were used as dielectric models. Impedance spectra were obtained, while relative permittivity, loss factor and impedance were also measured. The results concerning electrical parameters and permittivity at each temperature were an indicator of the structural changes and its reliability.
Anglický abstrakt
The present paper deals with the application of impedance spectroscopy method to test cement-based composites after their exposure to high temperatures. A type CEM I Portland cement, siliceous sand and shredded automobile tires were used to prepare mortar specimens. The specimens differentiated in whether or not a 10 % w/w acrylic polymer binder (polymer dispersion 20 % w/w to cement mass) addition to the mortar mixture was used. The specimens were exposed to high temperatures (temperature range: 25-400 degrees of Celsius). Monitoring of structural changes during subjection to thermal stress is an effective way to determine the reliability of specimens structure. Based on Debye's dielectric theory, the specimens were used as dielectric models. Impedance spectra were obtained, while relative permittivity, loss factor and impedance were also measured. The results concerning electrical parameters and permittivity at each temperature were an indicator of the structural changes and its reliability.
Dokumenty
BibTex
@inproceedings{BUT108795,
author="Ivo {Kusák} and Miroslav {Luňák} and Zdeněk {Chobola} and Michael {Tupý} and Konstantinos {Sotiriadis}",
title="Characterization of Thermal Stress of Building Materials Containing Rubber Granulate by Alternating Electric Field",
annote="The present paper deals with the application of impedance spectroscopy method to test cement-based composites after their exposure to high temperatures. A type CEM I Portland cement, siliceous sand and shredded automobile tires were used to prepare mortar specimens. The specimens differentiated in whether or not a 10 % w/w acrylic polymer binder (polymer dispersion 20 % w/w to cement mass) addition to the mortar mixture was used. The specimens were exposed to high temperatures (temperature range: 25-400 degrees of Celsius). Monitoring of structural changes during subjection to thermal stress is an effective way to determine the reliability of specimens structure. Based on Debye's dielectric theory, the specimens were used as dielectric models. Impedance spectra were obtained, while relative permittivity, loss factor and impedance were also measured. The results concerning electrical parameters and permittivity at each temperature were an indicator of the structural changes and its reliability.",
address="Trans Tech Publications",
booktitle="International Conference on Ecology and New Building Materials and Products",
chapter="108795",
doi="10.4028/www.scientific.net/AMR.1000.207",
howpublished="print",
institution="Trans Tech Publications",
number="8",
year="2014",
month="august",
pages="207--211",
publisher="Trans Tech Publications",
type="conference paper"
}