Ministerstvo průmyslu a obchodu ČR - Projektová konsorcia

- whole funder (2004-06-17 - not assigned)

FT-TA3/013

Czech

Szendiuch Ivan, doc. Ing., CSc. - principal person responsible

Department of Microelectronics
- (2004-06-17 - not assigned)

NOVOTNÝ, M.; SZENDIUCH, I. Chip Power Interconnection. In Proceeding of 30th International Spring Seminar on Electronics Technology. Napoca: TU of Cluj Napoca, 2007. p. 183 ( p.)ISBN: 1-4244-1218-8.
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VANĚK, J.; HLADÍK, J.; SZENDIUCH, I. Optimization of Propertief of Planar Spiral Inductors. In ISSE 2007 International Spring Seminar on Electronics Technology. Cluj-Napoca, Romania: Editura Mediamira, 2007. p. 120-122. ISBN: 978-973-713-174-4.
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NOVOTNÝ, M.; DVOŘÁK, T.; SZENDIUCH, I. Wire Bonding Power Interconnection. In Proceedings EMPC 2007 the 16th European Microelectronics and Packaging Conference & Exhibition, Part one. Finsko: 2007. p. 92-94. ISBN: 978-952-99751-1-2.
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Ivan Szendiuch, Jaroslav Jankovský, Marek Novotný. Perspektivní metody pouzdření polovodičových čipů. In BULETIN ANOTACÍ. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics". Brno: SMT-info konsorcium, 2007. s. 22 ( s.)ISSN: 1211-6947.
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NOVOTNÝ, M.; SZENDIUCH, I. Methods of Chip Interconnection. In Electronics Devices and Systems 07 Proceedings. Brno: Ing. Zdeněk Novotný CSc., 2007. p. 260-264. ISBN: 978-80-214-3470-7.
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SZENDIUCH, I. Eco-design as the Tool for Decreasing the Impact of Electronic Technology on Environment. In Proceedings IMAPS 2007. San Jose: IMAPS USA, 2007. s. 250-255. ISBN: 0-930815-82-3.
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SZENDIUCH, I.; NOVOTNÝ, M.; BARTOŇ, Z. Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections. In Proceedings IDT'07. Cairo: 2007. p. 242-245. ISBN: 978-1-4244-1824-4.
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SZENDIUCH, I.; HEJÁTKOVÁ, E.; NOVOTNÝ, M. Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability. In Proceedings ISSE 2007. Cluj-Napoca: TU Dresden, 2007. p. 124-129.
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SZENDIUCH, I. Curicullum for Lead-free Soldering. In Electronic Devices and Systems EDS 07. Brno: Ing. Zdeněk Novotný, 2007. p. 265-270. ISBN: 978-80-214-3470-7.
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SZENDIUCH, I.; VAŠKO, C. Multidisciplinary Aspects in Micro(Nano)electronics Technology Education. In Proceedings of the ICEE 2007. Coimbra: FCTUC, 2007. p. 144-149. ISBN: 978-972-8055-14-1.
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SZENDIUCH, I. Roadmap of Lead-free Soldering. In Proceedings ISSE 2007. 1. Cluj-Napoca: TU Dresden, 2007. p. 55-60. ISBN: 978-973-713-174-4.
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Szendiuch I., Prokop R.: FyzCON; Prototyp integrovaného obvodu pro měření fyzikálních vlastností kontaktů IO. Brno. (funkční vzorek)
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NOVOTNÝ, M.; JANKOVSKÝ, J.; SZENDIUCH, I.: Tester výkonových spojů; Testovací zařízení pro výzkum výkonově kontaktovaných čipů. UMEL. (funkční vzorek)
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