Publication result detail

Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

SZENDIUCH, I.; HEJÁTKOVÁ, E.; NOVOTNÝ, M.

Original Title

Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

English Title

Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

Type

Paper in proceedings (conference paper)

Original Abstract

deals with influence of lead-free thick film conductive materials on wire bonding

English abstract

deals with influence of lead-free thick film conductive materials on wire bonding

Keywords

lead-free, wire bonding

Key words in English

lead-free, wire bonding

Authors

SZENDIUCH, I.; HEJÁTKOVÁ, E.; NOVOTNÝ, M.

Released

09.05.2007

Publisher

TU Dresden

Location

Cluj-Napoca

Book

Proceedings ISSE 2007

Pages from

124

Pages to

129

Pages count

6

BibTex

@inproceedings{BUT28357,
  author="Ivan {Szendiuch} and Edita {Hejátková} and Marek {Novotný}",
  title="Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability",
  booktitle="Proceedings ISSE 2007",
  year="2007",
  pages="124--129",
  publisher="TU Dresden",
  address="Cluj-Napoca"
}