Publication result detail

Wire Bonding Power Interconnection

NOVOTNÝ, M.; DVOŘÁK, T.; SZENDIUCH, I.

Original Title

Wire Bonding Power Interconnection

English Title

Wire Bonding Power Interconnection

Type

Paper in proceedings (conference paper)

Original Abstract

This work describes chip interconnection. Especially thermomechanical stressing of these structures.

English abstract

This work describes chip interconnection. Especially thermomechanical stressing of these structures.

Keywords

Stress, wire bonding, chip interconnection, ANSYS

Key words in English

Stress, wire bonding, chip interconnection, ANSYS

Authors

NOVOTNÝ, M.; DVOŘÁK, T.; SZENDIUCH, I.

Released

01.01.2007

Location

Finsko

ISBN

978-952-99751-1-2

Book

Proceedings EMPC 2007 the 16th European Microelectronics and Packaging Conference & Exhibition, Part one

Pages from

92

Pages to

94

Pages count

3

BibTex

@inproceedings{BUT23962,
  author="Marek {Novotný} and Tomáš {Dvořák} and Ivan {Szendiuch}",
  title="Wire Bonding Power Interconnection",
  booktitle="Proceedings EMPC 2007 the 16th European Microelectronics and Packaging Conference & Exhibition, Part one",
  year="2007",
  number="první",
  pages="92--94",
  address="Finsko",
  isbn="978-952-99751-1-2"
}