Publication result detail

Curicullum for Lead-free Soldering

SZENDIUCH, I.

Original Title

Curicullum for Lead-free Soldering

English Title

Curicullum for Lead-free Soldering

Type

Paper in proceedings (conference paper)

Original Abstract

Overwiev of Lead-free soldering materials and processes and main process factors

English abstract

Overwiev of Lead-free soldering materials and processes and main process factors

Keywords

solder, lead-free solder

Key words in English

solder, lead-free solder

Authors

SZENDIUCH, I.

Released

20.09.2007

Publisher

Ing. Zdeněk Novotný

Location

Brno

ISBN

978-80-214-3470-7

Book

Electronic Devices and Systems EDS 07

Pages from

265

Pages to

270

Pages count

6

BibTex

@inproceedings{BUT28329,
  author="Ivan {Szendiuch}",
  title="Curicullum for Lead-free Soldering",
  booktitle="Electronic Devices and Systems EDS 07",
  year="2007",
  pages="265--270",
  publisher="Ing. Zdeněk Novotný",
  address="Brno",
  isbn="978-80-214-3470-7"
}