Publication result detail

Methods of Chip Interconnection

NOVOTNÝ, M.; SZENDIUCH, I.

Original Title

Methods of Chip Interconnection

English Title

Methods of Chip Interconnection

Type

Paper in proceedings (conference paper)

Original Abstract

This paper describes defferent methods of chip interconnection. (Bumps, wire bonding).

English abstract

This paper describes defferent methods of chip interconnection. (Bumps, wire bonding).

Keywords

wire bonding, ANSYS, solder balls

Key words in English

wire bonding, ANSYS, solder balls

Authors

NOVOTNÝ, M.; SZENDIUCH, I.

Released

01.01.2007

Publisher

Ing. Zdeněk Novotný CSc.

Location

Brno

ISBN

978-80-214-3470-7

Book

Electronics Devices and Systems 07 Proceedings

Pages from

260

Pages to

264

Pages count

4

BibTex

@inproceedings{BUT25296,
  author="Marek {Novotný} and Ivan {Szendiuch}",
  title="Methods of Chip Interconnection",
  booktitle="Electronics Devices and Systems 07 Proceedings",
  year="2007",
  number="první",
  pages="260--264",
  publisher="Ing. Zdeněk Novotný CSc.",
  address="Brno",
  isbn="978-80-214-3470-7"
}