Publication result detail

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

SZENDIUCH, I.; NOVOTNÝ, M.; BARTOŇ, Z.

Original Title

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

English Title

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

Type

Paper in proceedings (conference paper)

Original Abstract

study of wire bonding connection for power chips

English abstract

study of wire bonding connection for power chips

Keywords

wire bonding for high current

Key words in English

wire bonding for high current

Authors

SZENDIUCH, I.; NOVOTNÝ, M.; BARTOŇ, Z.

Released

23.10.2007

Location

Cairo

ISBN

978-1-4244-1824-4

Book

Proceedings IDT'07

Pages from

242

Pages to

245

Pages count

4

BibTex

@inproceedings{BUT28219,
  author="Ivan {Szendiuch} and Marek {Novotný} and Zdeněk {Bartoň}",
  title="Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections",
  booktitle="Proceedings IDT'07",
  year="2007",
  number="1",
  pages="242--245",
  address="Cairo",
  isbn="978-1-4244-1824-4"
}