Course detail
Design of electronic devices
FEKT-BKEZAcad. year: 2017/2018
Design and properties of signal lines, supply lines and distribution frames - suppression of interference and ground loops.
Parasitic events and their suppression - coupling in input and output circuits, parasitic capacitances and inductances, thermoelectric voltage, overvoltage on inductive load, reflections on lines, crosstalk. Electric and magnetic field screening, equipotential guarding. Choice of components and application recommendation - discrete elements, operational amplifiers, comparators, electronic switches, A/D and D/A converters, sample-and-hold elements, digital circuits, microprocessors. Mechanics design: regulation, control and indication elements - lay-out on the front panel, instrument housing design, heat removal, thermostatic elements. Printed circuits, wired printed circuits, connection of conductors and components. Safety requirements in instrument design. Methodology for the debugging of electronic device.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Department
Learning outcomes of the course unit
Prerequisites
Co-requisites
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
Up to 20 points can be had for design exercises. Part of the design exercises can be in the form of individual project. The examination proper is a written examination and up to 80 points can be awarded for it. The examination is focused on testing the knowledge of application principles in the design of electronic instruments, from the viewpoint of both electronic and mechanical solutions.
Course curriculum
2. Power supply source design and power distribution.
3. Connection and distribution of ground potential.
4. Parasitic phenomena and their suppression.
5. Shielding of electric and magnetic fields, equipotential shielding.
6. Selection of components and application principles.
6.1 Passive elements.
6.2 Operational amplifiers.
6.3 Comparators.
6.4 Analog-to-digital and digital-to-analog converters.
6.5 TTL digital circuits.
6.6 CMOS digital circuits.
7. Mechanical design.
7.1 Control and indicator elements and their lay-out
7.2 Types of instrument cases
7.3 Resistance of equipment to various environments
7.4 Heat removal from components and from instrument cases
7.5 thermal stabilization (thermostats)
8. Safety requirements for the design.
9. Debugging of devices.
9.1 Searching for faults in analog circuits
9.2 Searching for faults in digital circuits
Work placements
Aims
Specification of controlled education, way of implementation and compensation for absences
Recommended optional programme components
Prerequisites and corequisites
Basic literature
Buchanan J.E.: BiCMOS/CMOS system design. McGraw-Hill, New York 1998
FAIRCHILD: Analog - mixed signal, interface, logic, non-voltatile memory, power products. Fairchild Semiconductors, www.fairchildsemi.com
Ginsberg G. L.: Printed circuits design. McGraw-Hill, New York 1999
HALL, S.H.; HECK, H.L.: High-Speed Digital Designs. Wiley, 2009
LINEAR TECHNOLOGY: Linear Applications Handbook. Linear Technology, Milpitas 1999
NATIONAL SEMICONDUCTOR: National Analog and Interface Products Databook. National Semiconductor, Santa Clara 1999
NIKNEJAD, A.M.: Electromagnetics for High-Speed Analog and Digital Communication Circuits. Cambridge, 2007
Recommended reading
Classification of course in study plans
- Programme EECC Bc. Bachelor's
branch B-TLI , 3 year of study, summer semester, elective specialised
branch B-EST , 2 year of study, summer semester, elective interdisciplinary
branch B-AMT , 3 year of study, summer semester, elective interdisciplinary - Programme AUDIO-J Bachelor's
branch J-AUD , 3 year of study, summer semester, elective interdisciplinary
- Programme EEKR-CZV lifelong learning
branch EE-FLE , 1 year of study, summer semester, elective specialised
Type of course unit
Lecture
Teacher / Lecturer
Syllabus
Supply sources: mains supply, mains switches, transformers, means of interference suppression (suppression capacitors, suppression chokes, suppression elements)
Supply voltage distribution: supply distribution in instrument housing and on printed circuit boards, distribution in the ground, galvanic separation of systems (impulse tranformers, optrons)
Parasitic events and their suppression: coupling in input and outtput circuits, coupling on line resistances, parasitic capacitances and inductances, transient resistances, thermoelectric voltage, overvoltage on inductive load
Signal transmission over long lines: reflections in the lines, crosstalk, charging and discharging the lines
Electric and magnetic field screening: electric field screening of systems and lines, magnetic field screening of systems and lines
Equipotential guarding: insulation ring guarding, teflon support point, examples of active insulation of critical points
Selection of discrete components and application recommendation: resistors, potentiometers and potentiometric trimmers, capacotors and capacitive trimmers, inductors, diodes, transistors (bipolar, unipolar; power, HF)
Application recommendation for analog and digital integrated circuits: operational and transimpedance amplifiers, analog multiplexersand demultiplexers, comparators and timers, D/A and A/D converters, digital integrated circuits, microprocessors
Mechanics design: regulation and control elements and their lay-out, communication and indication elements, lay-out of regulation and communication elements on the front panel of the instrument, graphic and technical aspects of the mechanical part of design, design of instrument housing
Mechanical resistance of devices: resistance to shocks, vibration, moisture, water; abstraction of heat from the device, cooling elements, temperature stabilization (thermostatic control)
Connection of conductors and components: technology of printed circuit production, soldered connections, wire-wrap connections, cut-in connections; technology of surface assembly
Safety requirements: fundamental requirements, types of instrument classes, work environment, danger-to-touch protection, insulation requirements, surface paths and distances, movable lead-in wires
Laboratory exercise
Teacher / Lecturer
Syllabus
Principles of board design, assembly technologies used, effect of parasitic events on the board, supply distribution and blocking.
Librarian, Package, and Layout modules: defining the geometry elements, defining the board and package, board design, autorouters, adjustment possibilities.
Generating output data and processing them - data export and import.
Setting up the directory and paths, production of projects, relation to other modules, work in the network.
Connecting the system to the respective technological facilities.
Working on individual project.