Course detail

Microelectronics and Assembly Technology

FEKT-BMTSAcad. year: 2012/2013

The subject deals with principles of microelectronic passive and active components including their interconnection and packaging. It´s concerned to Surface Mount Technology, Thick and Thin Film Integrated Circuits and new performances of semiconductor packaging with impact on 3D configurations, as MCM, CSP, Flip Chip, WLP etc.

Language of instruction

Czech

Number of ECTS credits

Mode of study

Not applicable.

Guarantor

doc. Ing. Ivan Szendiuch, CSc.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

Basic knowledge and orientation in design and construction of electronic circuits, equipments and systems.

Prerequisites

The subject knowledge on the secondary school level is required.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

To give for students knowledge about technology of microelectronics components, circuits and systems

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Szendiuch,I.: Mikroelektronika a technologien součástek, Skriptum VUR vBrně, ÚMEL, ISBN 978-80-214-3960-3 (CS)

Recommended reading

Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (CS)

Classification of course in study plans

  • Programme EECC Bc. Bachelor's

    branch B-MET , 3 year of study, winter semester, compulsory
    branch B-EST , 3 year of study, winter semester, elective interdisciplinary

  • Programme EEKR-CZV lifelong learning

    branch EE-FLE , 1 year of study, winter semester, compulsory

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

doc. Ing. Ivan Szendiuch, CSc.

Syllabus

Microelectronics ant its development
Semiconductor chips - principle and their production
Basic performance of semiconductor chips and packaging
Thin and Thick Film Technology
Hybrid Integrated Circuits
SMD components for surface mount technology
Surface mount technology - technological operations
Technology of assembly (SMT)
Reliability Statistic Process Quality and cerfification in electronic production
Microelectronics and environment

Laboratory exercise

26 hod., compulsory

Teacher / Lecturer

Ing. Boleslav Psota, Ph.D.
Ing. Edita Hejátková
Ing. Petr Schnederle
Ing. Jiří Pulec, Ph.D.
doc. Ing. Martin Adámek, Ph.D.
Ing. Alexandr Otáhal, Ph.D.
Ing. Martin Klíma
Ing. Michal Štekovič
Ing. Michal Nicák, Ph.D.
Ing. Martin Buršík, Ph.D.
Ing. Michal Řezníček, Ph.D.

Syllabus

HI´C design and HIOCAD
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Reflow soldering and its temperature profile, lead free solders
Basic operation in SMT, assembly process