Course detail
Design and technology of electronic instruments
FEKT-BNKPAcad. year: 2012/2013
Design and demands on electronic instruments and its manufacturing. Security of measuring instruments against unfavourable external and internal influences. The take away of heat from instrument case. Security of persons against accidents caused by electricity. Grounding and shielding. Ergonometry of measuring instruments. Technical diagnostics.
Language of instruction
Czech
Number of ECTS credits
5
Mode of study
Not applicable.
Guarantor
Department
Learning outcomes of the course unit
The student acquires concrete application knowledge of electronic instrument design, which is otherwise obtained through long-term development practice. Emphasis is laid on understanding the physical essence of parasitic events so that their knowledge can be applied to other cases. He learns to foresee and anticipate the appearance of many problems arising in the development of new instruments in both the electrical and the mechanical part of the design.
Prerequisites
The subject knowledge on the secondary school level is required.
Co-requisites
Not applicable.
Planned learning activities and teaching methods
Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.
Assesment methods and criteria linked to learning outcomes
Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.
Course curriculum
1 - Industrial property protection
2 - Production technology preparation
3 - Electromagnetic compatibility (EMC)
4 - Signal distribution
5 - Power source distribution
6 - Parazitic couplings and transfers
7 - Shielding
8 - Thermal management
9 - Soldering
10 - Printed circuit boards
11 - Surface mount technology
12 - Diagnostics
13 - Safety requirements
14 - Quality management
2 - Production technology preparation
3 - Electromagnetic compatibility (EMC)
4 - Signal distribution
5 - Power source distribution
6 - Parazitic couplings and transfers
7 - Shielding
8 - Thermal management
9 - Soldering
10 - Printed circuit boards
11 - Surface mount technology
12 - Diagnostics
13 - Safety requirements
14 - Quality management
Work placements
Not applicable.
Aims
To be introduced to practicle principles of designing electronic instruments and devices as regards both electrical and mechanical aspects - in the industrial environment.
Specification of controlled education, way of implementation and compensation for absences
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.
Recommended optional programme components
Not applicable.
Prerequisites and corequisites
Not applicable.
Basic literature
Not applicable.
Recommended reading
Fowler, K.R.: Electronic instrument design. Oxford University Press, 1996 (EN)
Classification of course in study plans
Type of course unit
Lecture
26 hod., optionally
Teacher / Lecturer
Syllabus
Demands on electronic instruments and systems. Design methodology, technical documentation. Design of signal lines: symmetrical and non-symmetrical lines, properties of signal lines, execution of connections, printed circuits and their properties, optical lines.
Supply sources: mains supply, mains switches, transformers, means of interference suppression (suppression capacitors, suppression chokes, suppression elements). Supply voltage distribution: supply distribution in instrument housing and on printed circuit boards, distribution in the ground, galvanic separation of systems (impulse tranformers, optrons).
Parasitic events and their suppression: coupling in input and outtput circuits, coupling on line resistances, parasitic capacitances and inductances, transient resistances, thermoelectric voltage, overvoltage on inductive load.
Signal transmission over long lines: reflections in the lines, crosstalk, charging and discharging the lines.
Electric and magnetic field screening: electric field screening of systems and lines, magnetic field screening of systems and lines. Equipotential guarding: insulation ring guarding, teflon support point, examples of active insulation of critical points.
Selection of discrete components and application recommendation: resistors, potentiometers and potentiometric trimmers, capacotors and capacitive trimmers, inductors, diodes, transistors (bipolar, unipolar; power, HF).
Application recommendation for analog and digital integrated circuits: operational and transimpedance amplifiers, analog multiplexersand demultiplexers, comparators and timers, D/A and A/D converters, digital integrated circuits, microprocessors.
Mechanics design: regulation and control elements and their lay-out, communication and indication elements, lay-out of regulation and communication elements on the front panel of the instrument, graphic and technical aspects of the mechanical part of design, design of instrument housing.
Mechanical resistance of devices: resistance to shocks, vibration, moisture, water; abstraction of heat from the device, cooling elements, temperature stabilization (thermostatic control).
Connection of conductors and components: technology of printed circuit production, soldered.connections, wire-wrap connections, cut-in connections; technology of surface assembly.
Safety requirements: fundamental requirements, types of instrument classes, work environment, danger-to-touch protection, insulation requirements, surface paths and distances, movable liead-in wires.
Reliability of electronic instruments. Technical diagnostics and debugging of electronic instruments.
Quality management. Information in electronics, its collection and processing. Catalogues, electronic databases.
Supply sources: mains supply, mains switches, transformers, means of interference suppression (suppression capacitors, suppression chokes, suppression elements). Supply voltage distribution: supply distribution in instrument housing and on printed circuit boards, distribution in the ground, galvanic separation of systems (impulse tranformers, optrons).
Parasitic events and their suppression: coupling in input and outtput circuits, coupling on line resistances, parasitic capacitances and inductances, transient resistances, thermoelectric voltage, overvoltage on inductive load.
Signal transmission over long lines: reflections in the lines, crosstalk, charging and discharging the lines.
Electric and magnetic field screening: electric field screening of systems and lines, magnetic field screening of systems and lines. Equipotential guarding: insulation ring guarding, teflon support point, examples of active insulation of critical points.
Selection of discrete components and application recommendation: resistors, potentiometers and potentiometric trimmers, capacotors and capacitive trimmers, inductors, diodes, transistors (bipolar, unipolar; power, HF).
Application recommendation for analog and digital integrated circuits: operational and transimpedance amplifiers, analog multiplexersand demultiplexers, comparators and timers, D/A and A/D converters, digital integrated circuits, microprocessors.
Mechanics design: regulation and control elements and their lay-out, communication and indication elements, lay-out of regulation and communication elements on the front panel of the instrument, graphic and technical aspects of the mechanical part of design, design of instrument housing.
Mechanical resistance of devices: resistance to shocks, vibration, moisture, water; abstraction of heat from the device, cooling elements, temperature stabilization (thermostatic control).
Connection of conductors and components: technology of printed circuit production, soldered.connections, wire-wrap connections, cut-in connections; technology of surface assembly.
Safety requirements: fundamental requirements, types of instrument classes, work environment, danger-to-touch protection, insulation requirements, surface paths and distances, movable liead-in wires.
Reliability of electronic instruments. Technical diagnostics and debugging of electronic instruments.
Quality management. Information in electronics, its collection and processing. Catalogues, electronic databases.
Fundamentals seminar
14 hod., optionally
Teacher / Lecturer
Syllabus
Technical documentation
Basics of construction electronic instruments
Security of persons against accidents caused by electricity
Testing of the electronic devices
Parametrs of the electronic parts
Shielding, grounding, power and signal integrity.
Basics of construction electronic instruments
Security of persons against accidents caused by electricity
Testing of the electronic devices
Parametrs of the electronic parts
Shielding, grounding, power and signal integrity.
Exercise in computer lab
12 hod., optionally
Teacher / Lecturer
Syllabus
Programme LineSim a CAEME.
Programme Westbay Tools.
Basic characteristics of the CAM systems, their structure and control. Setting up the directory and paths, production of projects, relation to other modules, work in the network
Schematics module: principles of drawing schematic diagrams, levels of drawing, method of drawing schematic diagrams, checking for design correctness, content of libraries
Principles of board design, assembly technologies used, effect of parasitic events on the board, supply distribution and blocking, thermal analysis
Librarian, Package, and Layout modules: defining the geometry elements, defining the board and package, board design, autorouters, adjustment possibilities
Generating output data and processing them - the Fablink module, data export and import
Connecting the system to the respective technological facilities
Assessment of the individual project.
Programme Westbay Tools.
Basic characteristics of the CAM systems, their structure and control. Setting up the directory and paths, production of projects, relation to other modules, work in the network
Schematics module: principles of drawing schematic diagrams, levels of drawing, method of drawing schematic diagrams, checking for design correctness, content of libraries
Principles of board design, assembly technologies used, effect of parasitic events on the board, supply distribution and blocking, thermal analysis
Librarian, Package, and Layout modules: defining the geometry elements, defining the board and package, board design, autorouters, adjustment possibilities
Generating output data and processing them - the Fablink module, data export and import
Connecting the system to the respective technological facilities
Assessment of the individual project.