Course detail
Interconnection and assembly technolology
FEKT-MMOTAcad. year: 2011/2012
Organic and inorganic substrates. Technology steps in interconnection structures production. Microvia.
Technology of assemled interconnection structures. Surface Mount Technology (SMT). Types of package and basic of manipulation. Solder pastes, adhesives, fluxes and their application. Pick and place components methods. Soldering processes and technology of soldering. Strategy of testing.
Defects in interconnection structures and their causes.
Optimization of production process
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Learning outcomes of the course unit
Prerequisites
Co-requisites
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
Course curriculum
Work placements
Aims
Knowlodges espec. from SMT will be on higher level. Students will have practically closer view for individul factors in each operationand their influence for production process quality
Specification of controlled education, way of implementation and compensation for absences
Recommended optional programme components
Prerequisites and corequisites
Basic literature
Starý,J.,Šandera,J.,Kahle P.:Plošné spoje a povrchová montáž, PC DIR-REAL Brno, 1999 (CS)
Wassink, R. J. K.:Manufacturing Techniques for Surface Mounted Assemblies,Electrochemical Publications Ltd, GB 1995 (EN)
Recommended reading
Classification of course in study plans
Type of course unit
Lecture
Teacher / Lecturer
Syllabus
Organic base materials, electrical, mechanical and temperature properties. Trends in base materialsand requiremence. Inorganic base materials, their properties and comparison with organic ones.
Interconnection structures, sorting. Subtractive, semiadditive and additive methods. Trends
Technology procedures of single-layer, double layer and multi-layer PCB, Molded interconnect devices (MID). Microvia. Technology possibilities and trend.
Through Hole Technology (THT), Surface Mounted Technology (SMT) and combined THT and SMT. Technology procedures. Trend in SMT.
Solder pastes. solder alloys, adhesives, fluxes, conformal coatings and encapsulants
Application technology /screen and stencil printing, dispense/. Population of SMD, pick and place machines, principles, methods of component centering.
Surface Mounted Devices (SMD), properties and packaging, component leads, IC packages, passive components, electromechanical devices, Ball Grid Array (BGA), construction.
Soldering, methds of soldering, solder joint and solder joint reliability. Vawe soldering techniques, nitrogen atmosphere influence. Manual soldering, principles. <>Reflow soldering, methods, forced concection and nitrogen atmosphere influence. Temperature profiling. Strategy of testing. Testing of assembled and non assembled PCB. Quality control. Methods.
PCB repairs, contact and contactless methods for components disassembly and assembly. Principles and techniques for repairing. Requirements for PCB according třo IPC and Czech standards, Electrostatic Discharge (ESD)
Reliability in assembly process ond main factors.
Defects in interconnection structures and their causes.
Laboratory exercise
Teacher / Lecturer
Syllabus
Prototype production process of double - layer PCB in BUNGARD/PROTOCAD line
Surface Mount Technology - printing/dispensing of solder paste/adhesive, program preparing for semiautomatic machine, pick and place with semiautomatic machine, reflow soldering, quality control
Requirements for quality of SMD placement and soldering
Contact/contactless method for assembly/disassembly SMD
Types of packages, component marking, ESD (interactive PC educational program) <>