Course detail
Printed Circuits and Surface Mount Technology
FEKT-KPSMAcad. year: 2011/2012
Basic materials for production of printed circuit boards (PCB) properties, application, comparison with inorganic substrates. Technological procedures of production of single-, double- and multi-layer PCB. New technological trends of PCB production with emphasis on microconnecting structures. Surface and combined mounting of electronic parts. Acquaintance with the mounting process starting by parts and used chemistry at the beginning up to repairs and requirements of quality
Language of instruction
Czech
Number of ECTS credits
5
Mode of study
Not applicable.
Guarantor
Learning outcomes of the course unit
The student will be able to orientated themselves fully in extensive problems connected with production of printed circuit boards.
Prerequisites
The subject knowledge on the secondary school level is required.
Co-requisites
Not applicable.
Planned learning activities and teaching methods
Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.
Assesment methods and criteria linked to learning outcomes
Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.
Course curriculum
1. Base materials for Printed Circuit Boards (PCBś) production, organic, inorganic, reinforcements, resins, copper clad materials. Base materials organic rigid, flexible, rigid/flexible, semiflexible. Properties: electrical, mechanical, thermal, chemical. Standard ČSN EN 61249 – xx – xx.
(Starý) (2 hod.)
2. Organic base materials, properties. Base materials inorganic, comparison with organic. Requirements for base materials, latest trends and development in base materials area. MID.
(Starý) (2 hod.)
3. Interconnection structures, types. Subtractive, semiaditive and aditive methods of production interconnecton structures. PCBś production - main orientation. Base steps in PCBś production. Technology procedure of single, double and multilayer PCB.
(Starý) (2 hod.)
4. Interconnection structures with microvia, SBU methods. PCBś assembly - through hole technology (THT) and surface mount technology (SMT), mixed. Technology procedures. Latest trends in SMT.
(Starý) (2 hod.)
5. Surface moun devices (SMDś), packages, properties, type of leads, IC packages, passive components, elektromechanical devices, BGA packages, construction.
(Šandera) (2 hod.)
6. "Chemistry in assembly" and correct application in process /solder paste, solder alloy, adhesive, conformal coating, packaging material/ (Starý) (2 hod.)
7. Semi semester test (10 questions/9 minutes). Application techniques /screen printing, stencil printing, dispensing/. Stencils, screens - preparation. Basic for quality in printing, factors.
(Starý) (2 hod.)
8. Optical inspection after printing (SPI). Placement of SMDś, pick and place machines, methods of centering components.
(Starý) (2 hod.)
9. Soldering, solder joint, requirements for solder joint. Soldered joint vs. welded joint vs. joint realised with adhesive - comparison. Methods of soldering. Requirements for quality of placement and soldering acc. to IPC A 610 rev. D.
(Starý) (2 hod.)
10. Solder joint reliability. Lead free vs. lead soldering. Thermal management of PCB. Temperature profile measurememts.
(Starý) (2 hod.)
11. Wave soldering (mass), nitrogen atmosphere infuence. Manual soldering, principles, soldering tips maintenance. Reflow soldering, methods, forced convection and nitrogen atmosphere influence.
(Starý) (2 hod.)
12. Testing of assembled and non-assembled PCBś. Quality control, methods. Automatic Optical Inspection (AOI). Statistical tools for quality testing and improvement.
(Starý) (2 hod.)
13. Rework and repairs of PCBś. Contact and hot air/nitrogen method of deassembly and asembly components. Principles and techniques of repairs. Requirements for PCBś quality acc. to IPC and European standards.
(Starý) (2 hod.).
(Starý) (2 hod.)
2. Organic base materials, properties. Base materials inorganic, comparison with organic. Requirements for base materials, latest trends and development in base materials area. MID.
(Starý) (2 hod.)
3. Interconnection structures, types. Subtractive, semiaditive and aditive methods of production interconnecton structures. PCBś production - main orientation. Base steps in PCBś production. Technology procedure of single, double and multilayer PCB.
(Starý) (2 hod.)
4. Interconnection structures with microvia, SBU methods. PCBś assembly - through hole technology (THT) and surface mount technology (SMT), mixed. Technology procedures. Latest trends in SMT.
(Starý) (2 hod.)
5. Surface moun devices (SMDś), packages, properties, type of leads, IC packages, passive components, elektromechanical devices, BGA packages, construction.
(Šandera) (2 hod.)
6. "Chemistry in assembly" and correct application in process /solder paste, solder alloy, adhesive, conformal coating, packaging material/ (Starý) (2 hod.)
7. Semi semester test (10 questions/9 minutes). Application techniques /screen printing, stencil printing, dispensing/. Stencils, screens - preparation. Basic for quality in printing, factors.
(Starý) (2 hod.)
8. Optical inspection after printing (SPI). Placement of SMDś, pick and place machines, methods of centering components.
(Starý) (2 hod.)
9. Soldering, solder joint, requirements for solder joint. Soldered joint vs. welded joint vs. joint realised with adhesive - comparison. Methods of soldering. Requirements for quality of placement and soldering acc. to IPC A 610 rev. D.
(Starý) (2 hod.)
10. Solder joint reliability. Lead free vs. lead soldering. Thermal management of PCB. Temperature profile measurememts.
(Starý) (2 hod.)
11. Wave soldering (mass), nitrogen atmosphere infuence. Manual soldering, principles, soldering tips maintenance. Reflow soldering, methods, forced convection and nitrogen atmosphere influence.
(Starý) (2 hod.)
12. Testing of assembled and non-assembled PCBś. Quality control, methods. Automatic Optical Inspection (AOI). Statistical tools for quality testing and improvement.
(Starý) (2 hod.)
13. Rework and repairs of PCBś. Contact and hot air/nitrogen method of deassembly and asembly components. Principles and techniques of repairs. Requirements for PCBś quality acc. to IPC and European standards.
(Starý) (2 hod.).
Work placements
Not applicable.
Aims
The aim of the subject is to make students familiar with the problems of printed circuit boards production and to initiate them into the possibilities of material and technology, which are available at present time.
Specification of controlled education, way of implementation and compensation for absences
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.
Recommended optional programme components
Not applicable.
Prerequisites and corequisites
Not applicable.
Basic literature
LEA, C.: A Scientific Guide to Surface Mount Technology, Electrochemical Publications Ltd., GB 1998 (EN)
Norma ANSI/IPC-A-610 rev. E, The Institute for Electronic and Packaging Electronic Circuits, USA (CS)
Starý, J., Šandera, J., Kahle, P.: Plošné spoje a povrchová montáž, PC DIR - REAL Brno, 1999 (CS)
Wassing, R.J.K.:Manufacturing Techniques for Surface Mounted Assemblies, Electrochemical Publications Ltd. GB 1995 (EN)
Norma ANSI/IPC-A-610 rev. E, The Institute for Electronic and Packaging Electronic Circuits, USA (CS)
Starý, J., Šandera, J., Kahle, P.: Plošné spoje a povrchová montáž, PC DIR - REAL Brno, 1999 (CS)
Wassing, R.J.K.:Manufacturing Techniques for Surface Mounted Assemblies, Electrochemical Publications Ltd. GB 1995 (EN)
Recommended reading
Not applicable.
Classification of course in study plans
Type of course unit
Lecture
26 hod., optionally
Teacher / Lecturer
Syllabus
Basic organic materials, kinds of bonding agent stiffeners, plated basic materials. Solid and flexible basic organic materials.
Basic organic materials, electrical, mechanical and also heat properties. Basic inorganic materials and comparison with organic materials.
Principles of PCB design, form and size of soldering spots and conductive paths. Principles of design for wave soldering and soldering by remelting.
Principles of PCB design, design of non-soldering mask, design of soldering spots for BGA and CSP, examples of footprints for SMT
Mounting and interconnecting structures, kinds. Subtractive, semiadditive and additive methods of production of mounting and interconnecting structures. Major application trends in electrotechnics.
Technological procedures of production of single-layer, double-layer and multi-layer PCB. Microinterconnecting (microvia) structures, MID. Separate operations of production process.
Assembly, surface and combined mount of PCB. Technological procedures. New trends in SMT.
Chemistry in mounting process and its correct choice (soldering paste, soldering alloys, adhesives, fluxing agents conformal coatings, packaging materials)
Application technologies (screen process printing, stencil printing, dispension). Process of SMD population, populating automatic machines, principles, methods of component centering .
SMD, properties and execution, outlets of parts, packages for IO, passive parts, electromechanical elements, BGA packages, design.
Soldering, methods of soldering, soldered connection and reliability of soldered connection. Machine soldering by wave, influence of nitrogen protective atmosphere. Manual soldering, principles.
Reflow soldering, methods, forced convection and influence of nitrogen atmosphere. Measurement of temperature profiles. Testing of non-populated and populated DPS, quality checking, checking methods.
Repairs of DPS, contact and contactless methods of assembly/disassembly. Principles and technique of repairs. Requirements on DPS according to IPC and Czech standards, antistatic prevention.
Basic organic materials, electrical, mechanical and also heat properties. Basic inorganic materials and comparison with organic materials.
Principles of PCB design, form and size of soldering spots and conductive paths. Principles of design for wave soldering and soldering by remelting.
Principles of PCB design, design of non-soldering mask, design of soldering spots for BGA and CSP, examples of footprints for SMT
Mounting and interconnecting structures, kinds. Subtractive, semiadditive and additive methods of production of mounting and interconnecting structures. Major application trends in electrotechnics.
Technological procedures of production of single-layer, double-layer and multi-layer PCB. Microinterconnecting (microvia) structures, MID. Separate operations of production process.
Assembly, surface and combined mount of PCB. Technological procedures. New trends in SMT.
Chemistry in mounting process and its correct choice (soldering paste, soldering alloys, adhesives, fluxing agents conformal coatings, packaging materials)
Application technologies (screen process printing, stencil printing, dispension). Process of SMD population, populating automatic machines, principles, methods of component centering .
SMD, properties and execution, outlets of parts, packages for IO, passive parts, electromechanical elements, BGA packages, design.
Soldering, methods of soldering, soldered connection and reliability of soldered connection. Machine soldering by wave, influence of nitrogen protective atmosphere. Manual soldering, principles.
Reflow soldering, methods, forced convection and influence of nitrogen atmosphere. Measurement of temperature profiles. Testing of non-populated and populated DPS, quality checking, checking methods.
Repairs of DPS, contact and contactless methods of assembly/disassembly. Principles and technique of repairs. Requirements on DPS according to IPC and Czech standards, antistatic prevention.
Exercise in computer lab
4 hod., compulsory
Teacher / Lecturer
Syllabus
Design system - basic rules
Design system and technological outputs
Design system and technological outputs
Laboratory exercise
18 hod., compulsory
Teacher / Lecturer
Syllabus
Organic basic materials, properties. Principles of choice of material.
Production of single-layer and double-layer PCB on the line BUNGARD/PROTOCAD.
Soldering paste, adhesives, fluxing agents. Properties and distribution Technical and safety sheets, manipulation and storing, principles.
Screen process printing/template printing. Screens, templates, properties. Printing of soldering paste. Factors influencing quality of print, defects and their reasons.
Semiautomatic population of SMD, creating program. Dispension of adhesive. Population of SMD into soldering paste. Mounting procedures, discussion.
Reflow soldering with solder paste, measuring of temperature profiles and principles. Defects of soldered joints. Test of the solder paste for solder balling.
Repairs of assembly units by contact method/hot air. Assembly/disassembly of chips (0805, 1206), SOIC, QFP.
Requirements for population and soldering of SMD. Checking quality of assembly unit according to IPC-A-610B.
Production of single-layer and double-layer PCB on the line BUNGARD/PROTOCAD.
Soldering paste, adhesives, fluxing agents. Properties and distribution Technical and safety sheets, manipulation and storing, principles.
Screen process printing/template printing. Screens, templates, properties. Printing of soldering paste. Factors influencing quality of print, defects and their reasons.
Semiautomatic population of SMD, creating program. Dispension of adhesive. Population of SMD into soldering paste. Mounting procedures, discussion.
Reflow soldering with solder paste, measuring of temperature profiles and principles. Defects of soldered joints. Test of the solder paste for solder balling.
Repairs of assembly units by contact method/hot air. Assembly/disassembly of chips (0805, 1206), SOIC, QFP.
Requirements for population and soldering of SMD. Checking quality of assembly unit according to IPC-A-610B.