Publication result detail

On the Application of Solder Balls for 3D Packaging

SZENDIUCH, I.; NICÁK, M.

Original Title

On the Application of Solder Balls for 3D Packaging

English Title

On the Application of Solder Balls for 3D Packaging

Type

Peer-reviewed article not indexed in WoS or Scopus

Original Abstract

Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations

English abstract

Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations

Keywords

solder ball, soldering, 3D configuration, 3D packaging

Key words in English

solder ball, soldering, 3D configuration, 3D packaging

Authors

SZENDIUCH, I.; NICÁK, M.

RIV year

2011

Released

02.08.2010

Publisher

E.G.Leuze Verlag KG

Location

Německo

ISBN

1436-7505

Periodical

PLUS

Volume

2010

Number

8

State

Federal Republic of Germany

Pages from

1855

Pages to

1860

Pages count

6

BibTex

@article{BUT50612,
  author="Ivan {Szendiuch} and Michal {Nicák}",
  title="On the Application of Solder Balls for 3D Packaging",
  journal="PLUS",
  year="2010",
  volume="2010",
  number="8",
  pages="1855--1860",
  issn="1436-7505"
}