Detail publikačního výsledku

Usage of LTCC Technology in Electronic Packaging

PSOTA, B.; KLÍMA, M.; NICÁK, M.; SZENDIUCH, I.

Original Title

Usage of LTCC Technology in Electronic Packaging

English Title

Usage of LTCC Technology in Electronic Packaging

Type

Peer-reviewed article not indexed in WoS or Scopus

Original Abstract

The paper deals with the new type of the package creation, where the LTCC technology is used for this purpose. Complete process of the package design as well as manufacture of the package is described.

English abstract

The paper deals with the new type of the package creation, where the LTCC technology is used for this purpose. Complete process of the package design as well as manufacture of the package is described.

Keywords

LTCC, package, ANSYS

Key words in English

LTCC, package, ANSYS

Authors

PSOTA, B.; KLÍMA, M.; NICÁK, M.; SZENDIUCH, I.

RIV year

2014

Released

25.06.2013

ISBN

2161-2528

Periodical

Electronics Technology (ISSE)

Volume

36

Number

2013

State

United States of America

Pages from

206

Pages to

209

Pages count

4

Full text in the Digital Library

http://hdl.handle.net/

BibTex

@article{BUT100235,
  author="Boleslav {Psota} and Martin {Klíma} and Michal {Nicák} and Ivan {Szendiuch}",
  title="Usage of LTCC Technology in Electronic Packaging",
  journal="Electronics Technology (ISSE)",
  year="2013",
  volume="36",
  number="2013",
  pages="206--209",
  issn="2161-2528"
}