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Bachelor's Thesis
Author of thesis: Jiří Maňák
Acad. year: 2025/2026
Supervisor: Ing. Jiří Starý, Ph.D.
Reviewer: Ing. Robert Bayer, PhD.
The thesis deals with the issue of QFN package, from its manufacturing and the attachment of the internal semiconductor structure, through package assembly and mounting onto a printed circuit board, to repair and replacement procedures. The topic is highly relevant due to current trends in miniaturization, integration, and increasing operating frequencies. The introductory part focuses on the historical reasons behind the development of QFN packages, their standardization, and a comparison with THT technology. The main part of the thesis addresses the technology of interconnection with the PCB, methods of testing, ensuring the reliability of solder joints, and evaluating the electrical properties of the interconnections.
QFN, development, package, technology, MSD, ESD, electrical properties, repair.
Date of defence
17.06.2026
Result of the defence
Defended (thesis was successfully defended)
Grading
B
Process of defence
Student seznámil státní zkušební komisi s cíli a řešením závěrečné vysokoškolské práce a zodpověděl otázky a připomínky oponenta a komise. Otázky komise k obhajobě: 1. Jak probíhala čtyřbodová metoda měření odporu?
Language of thesis
Czech
Faculty
Fakulta elektrotechniky a komunikačních technologií
Department
Department of Electrical and Electronic Technology
Study programme
Microelectronics and Technology (BPC-MET)
Composition of Committee
prof. Ing. Jiří Kazelle, CSc. (předseda) doc. Ing. Petr Vyroubal, Ph.D. (místopředseda) Ing. Pavel Čudek, Ph.D. (člen) Ing. Jiří Starý, Ph.D. (člen) Ing. Kamil Jaššo, Ph.D. (člen) Ing. Ladislav Chladil, Ph.D. (člen)
Supervisor’s reportIng. Jiří Starý, Ph.D.
Grade proposed by supervisor: A
Reviewer’s reportIng. Robert Bayer, PhD.
Grade proposed by reviewer: B
Responsibility: Mgr. et Mgr. Hana Odstrčilová