Course detail
Microelectronics and Assembly Technology
FEKT-KMTSAcad. year: 2010/2011
The subject deals with development of microelectronic passive and active components including interconnection and packaging. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits and new performances of semiconductor as MCM, CSP, Flip Chip etc.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Department
Learning outcomes of the course unit
Prerequisites
Co-requisites
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
Course curriculum
Work placements
Aims
Specification of controlled education, way of implementation and compensation for absences
Recommended optional programme components
Prerequisites and corequisites
Basic literature
Recommended reading
Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (CS)
Classification of course in study plans
Type of course unit
Lecture
Teacher / Lecturer
Syllabus
Semiconductor chips - principle and their production
Basic performance of semiconductor chips and packaging
Thin and Thick Film Technology
Hybrid Integrated Circuits
SMD components for surface mount technology
Surface mount technology - technological operations
Multi Chip Modules
CSP and Flip Chip technology
Reliability of electrical joint, soldering
Quality and cerfification in electronic production
Statistic Process Control
Microelectronics and environment
Laboratory exercise
Teacher / Lecturer
Syllabus
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Testing and packaging
Assembly of Fine Pitch components
Thick film sensors