Course detail
Electronic Components Production
FEKT-MPA-VSKAcad. year: 2024/2025
The course deals with basic physical principles of semiconductors, including their production. The course provides an overview of semiconductor chip development, production of individual types of components and their connection. The course is focused mainly on various types of diodes and transistors, the problems of their production with explanation of individual manufacturing operations (Oxidation, epitaxy, photolithography, diffusion, implantation) and phenomena that may occur in components (Stress migration, electromigration). The individual manufacturing operations are explained and demonstrated in the laboratory in an illustrative way so that the student gains basic knowledge about the structure of semiconductor devices and their function. Lessons are supervised by expert from practice (firm ON Semiconductor Czech Republic, s.r.o.). The subject offers a good overview about technological processes that are used for semiconductor technologies.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Department
Entry knowledge
Rules for evaluation and completion of the course
40 points - laboratory exercise
60 points - final exam
The student must obtain at least 50% of the marks in each part of the assessment.
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.
Theoretical exercise - calculations of oxidation times, diffusion and depth of semiconductor transition.
Laboratory exercise and project - design and description of production of student semiconductor chip performed in the laboratory (cleaning, photolithography, metallization, etc.).
Aims
Student after completing the course:
1. knows division and the basic principles of semiconductor devices realization,
2. understands and knows the fundamentals of semiconductor devices and describes their use,
3. will explain the implementation steps in the process of manufacturing basic semiconductor devices for experimental activities in the laboratory,
4. takes an opinion on the possibility of employment in manufacturing, service and design institutions in the field of semiconductor components.
Study aids
Prerequisites and corequisites
Basic literature
Sze, S., M., Kwok, K., N., G.: Physics of semiconductor devices. 3rd ed. Hoboken: Wiley-Interscience, 2007, ISBN: 978-0-471-14323-9 (EN)
Recommended reading
Classification of course in study plans
Type of course unit
Lecture
Teacher / Lecturer
Syllabus
Semiconductor components and chips
Future development in chip production, lithography
Chip assemblly - ultrasonic and termocompresion bonding
Thick and thin film technology and circuits
Hybrid Integrated Circuits
Surface Mounted Devices
SMT I - substrate and solder paste deposition
SMT II - component placement
SMT III - vawe and reflow soldering
Rework and repair in SMT
Quality and statistical process control
TQM, certifikation, CE
Laboratory exercise
Teacher / Lecturer
Syllabus
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Testing and packaging
Assembly of Fine Pitch components
Thick film sensors