Course detail
Electronic Components Production
FEKT-MPC-VSKAcad. year: 2023/2024
The course deals with basic physical principles of semiconductors, including their production. The course provides an overview of semiconductor chip development, production of individual types of components and their connection. The course is focused mainly on various types of diodes and transistors, the problems of their production with explanation of individual manufacturing operations (Oxidation, epitaxy, photolithography, diffusion, implantation) and phenomena that may occur in components (Stress migration, electromigration). The individual manufacturing operations are explained and demonstrated in the laboratory in an illustrative way so that the student gains basic knowledge about the structure of semiconductor devices and their function. Lessons are supervised by expert from practice (firm ON Semiconductor Czech Republic, s.r.o.). The subject offers a good overview about technological processes that are used for semiconductor technologies.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Department
Entry knowledge
Rules for evaluation and completion of the course
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.
Theoretical exercise - calculations of oxidation times, diffusion and depth of semiconductor transition.
Laboratory exercise and project - design and description of production of student semiconductor chip performed in the laboratory (cleaning, photolithography, metallization, etc.).
Aims
Student after completing the course:
1. knows division and the basic principles of semiconductor devices realization,
2. understands and knows the fundamentals of semiconductor devices and describes their use,
3. will explain the implementation steps in the process of manufacturing basic semiconductor devices for experimental activities in the laboratory,
4. takes an opinion on the possibility of employment in manufacturing, service and design institutions in the field of semiconductor components.
Study aids
Prerequisites and corequisites
Basic literature
I. Szendiuch, V. Musil, J. Stehlík. Výroba součástek a konstrukčních prvků. Elektronický studijní text. 2006. 84 str., VUT FEKT Brno. Brno: VUT Brno, 2006. s. 1 ( s.) (CS)
MUSIL, V. a kol.: Výroba součástek a konstrukčních prvků. Nanotechnologie. Prezentace projektu KISP. VUT v Brně, 2015 (CS)
POOLE,C.P.(JR). -OWENS, F.J.: Introduction to Nanotechnology, Wiley Interscience, 2003 ISBN:0-471-07935-9 (EN)
STRAKOŠ, V.: Výroba součástek a konstrukčních prvků. Prezentace projektu KISP, VUT v Brně, 2015 (CS) (CS)
SZENDIUCH, I. a kol. Technologie elektronických obvodů a systémů. GA102/00/ 0969. GA102/00/ 0969. Brno: Nakladatelství VUTIUM, Brno, 2002. 289 s. ISBN: 80-214-2072- 3. (CS)
YING J. Y.: Nanostructured Materials. Academic Press, San Diego 2001 STREETMAN, B.G. –BANERJEE, S.K.: Solid state electronic devices. Prentice Hall, 2010, ISBN 978-0-13-245479-7 (EN)
Recommended reading
Elearning
Classification of course in study plans
- Programme MPC-MEL Master's 2 year of study, winter semester, compulsory
Type of course unit
Lecture
Teacher / Lecturer
Syllabus
1. Selected physical principles
3. Metal–semiconductor junction, Schottky diode
4. Bipolar transistor
5. MIS Diode
6. Transistor JFET
7. Transistor MOSFET
8. Integrity of gate oxide
9. Hot carrier injection (HCI)
10. Stress migration and electromigration in metallization.
11. Plasma induced damage (PID)
12. Oxidation and epitaxy of silicon
13. Photolithography
14. Diffusion and implantation
15. Metallization
Laboratory exercise
Teacher / Lecturer
Syllabus
Elearning