Course detail

Electronic Components Production

FEKT-MPA-VSKAcad. year: 2023/2024

The course deals with basic physical principles of semiconductors, including their production. The course provides an overview of semiconductor chip development, production of individual types of components and their connection. The course is focused mainly on various types of diodes and transistors, the problems of their production with explanation of individual manufacturing operations (Oxidation, epitaxy, photolithography, diffusion, implantation) and phenomena that may occur in components (Stress migration, electromigration). The individual manufacturing operations are explained and demonstrated in the laboratory in an illustrative way so that the student gains basic knowledge about the structure of semiconductor devices and their function. Lessons are supervised by expert from practice (firm ON Semiconductor Czech Republic, s.r.o.). The subject offers a good overview about technological processes that are used for semiconductor technologies.

Language of instruction

English

Number of ECTS credits

6

Mode of study

Not applicable.

Guarantor

Ing. Martin Adámek, Ph.D.

Department

Department of Microelectronics (UMEL)

Entry knowledge

The subject knowledge on the Bachelor´s degree level is requested.

Rules for evaluation and completion of the course

The conditions for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year. 

40 points - laboratory exercise

60 points - final exam

The student must obtain at least 50% of the marks in each part of the assessment. 


The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.
Theoretical exercise - calculations of oxidation times, diffusion and depth of semiconductor transition.
Laboratory exercise and project - design and description of production of student semiconductor chip performed in the laboratory (cleaning, photolithography, metallization, etc.).

Aims

The main aim of the course is to give students a basic knowledge about the basics of semiconductor technology. The aim of the course in the theoretical part is to acquaint students with basic physical properties of semiconductors, principles of semiconductor devices function, their curent conception and basics of their production. In the practical part of the course, the aim is to acquire basic knowledge and skills for working with semiconductors in a clean laboratory so that students will be able to to join research, development and production subjects, and also to continue in the scientific activities.
Student after completing the course:
1. knows division and the basic principles of semiconductor devices realization,
2. understands and knows the fundamentals of semiconductor devices and describes their use,
3. will explain the implementation steps in the process of manufacturing basic semiconductor devices for experimental activities in the laboratory,
4. takes an opinion on the possibility of employment in manufacturing, service and design institutions in the field of semiconductor components.

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Sze, S., M., Kwok, K., N., G.: Physics of semiconductor devices. 3rd ed. Hoboken: Wiley-Interscience, 2007, ISBN: 978-0-471-14323-9 (EN)
Abraham, B., Chang, K., Ch., et al.: Nano Devices and Sensors. Walter De Gruyter, 2016, ISBN 1501510509 (EN)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme MPA-MEL Master's, 2. year of study, winter semester, compulsory
  • Programme MPAD-MEL Master's, 2. year of study, winter semester, compulsory

Type of course unit

 

Lecture

39 hours, optionally

Teacher / Lecturer

Ing. Martin Adámek, Ph.D.

Syllabus

Microelectronics and its trends, technological integration
Semiconductor components and chips
Future development in chip production, lithography
Chip assemblly - ultrasonic and termocompresion bonding
Thick and thin film technology and circuits
Hybrid Integrated Circuits
Surface Mounted Devices
SMT I - substrate and solder paste deposition
SMT II - component placement
SMT III - vawe and reflow soldering
Rework and repair in SMT
Quality and statistical process control
TQM, certifikation, CE

Laboratory exercise

26 hours, compulsory

Teacher / Lecturer

Ing. Martin Adámek, Ph.D.

Syllabus

HI´C design and HIOCAD
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Testing and packaging
Assembly of Fine Pitch components
Thick film sensors