Course detail

New Technology for Microelectronic Circuits

FEKT-MPA-MTEAcad. year: 2023/2024

The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectives during the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Low Temperature Cofired Ceramics are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex view for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation.

Language of instruction


Number of ECTS credits


Mode of study

Not applicable.

Entry knowledge

The subject knowledge on the Bachelor´s degree level and valid examination for electrotechnical qualification of employees for independent activity (in accordance with §6 of the Decree) are requested.

Rules for evaluation and completion of the course

Laboratory : 12 pts
HIO design: 8 pts
Written and oral exam: 80 pts
Laboratory - design, implementation and testing of modern components:

1. Hybrid integrated circuit design
2. Realization of hybrid integrated circuit
3. Packaging and interconnection of microelectronic structures
4. Soldering of complex electronic packages
5. Production of LTCC structures


To give a future engineers knowledge about new principles of design, assembly, production and maintenance of electronic circuits, equipments and systems, so that they will be able to join research, development and production subjects, and also to continue in the scientific activities.
Student after completing the course:

1. Describes modern technologies used in the implementation of electronic hardware
2. Explain the basic principles of modern electronic components, from their production to applications
3. Handles theoretical and practical knowledge enabling to design and use modern components of electronic hardware, to work with their parameters
4. Designs hybrid integrated circuits and has the ability to decide on the design and construction of new circuit design
5. Is able to decide on application in design, production and service institutions in the field of microelectronics and electrical engineering, as well as acquiring prerequisites for further scientific work

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Li, Y., Goyal, D.: 3D Microelectronic Packaging: From Fundamentals to Applications, Springer; 1st edition, 2017, ISBN: 978-3-319-44586-1 (EN)
Liu, S., Liu, Y.: Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing, Wiley; 1 edition, 2011, ISBN: 978-0470827802 (EN)
Tummala, R.: Fundamentals of Device and Systems Packaging: Technologies and Applications, McGraw-Hill Education; 2 edition, 2019, ISBN: 978-1259861550 (EN)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme MPA-EEN Master's, 2. year of study, winter semester, compulsory-optional
  • Programme MPA-MEL Master's, 2. year of study, winter semester, compulsory
  • Programme MPAD-MEL Master's, 2. year of study, winter semester, compulsory

Type of course unit



39 hours, optionally

Teacher / Lecturer

Laboratory exercise

26 hours, compulsory

Teacher / Lecturer