Course detail

Microelectronic Practice

FEKT-BKC-MEPAcad. year: 2023/2024

The lecture which essential acquaints students with specializate laboratories in Department of Microelectronics which will be used during study in higher years. The lectures includes:
1) Methodology of printed board design (classic and SMT) with respect on assembly techiques, system EAGLE presentation and practice work with it. Simply electronic circuit design.
2) Electronic circuit realization. Realization with handle soldering by industry technical documentation. Surface mount technology is used with lead free soldering.
3) Revival of circuit ( sig. generator, oscillograph, multimetr).
4) Presentation and realization of simply tasks which concern assembly techniques in microelectronic (thin and thick layer technology, chip bonding technology, packaging technology), demonstration of laser techniques.

Language of instruction


Number of ECTS credits


Mode of study

Not applicable.

Entry knowledge

The subject knowledge on the secondary school level are required.

Rules for evaluation and completion of the course

Credit will be realized on the base of regular visiting all parts of lectures (visiting sign teacher in paper)

All excercise are mandatory. The regular apologied excercises students could compensate after consultation with teacher in the part of lecture (during semester, in extremis in the credit week).


The subject generally introduces with electronic and microelectronic design methodology, introduces with laboratory equipment and technology and introduce with content of special lectures, which students will attend in higher years of study.
Graduater is able:
- design simple printed board for classic and surface assemby in CAD system EAGLE
- hand solder simple circuit with chip components in packages 1206, 0805 and SO
- realize basic measure with generetor, ocsillograph, multimetr
- replace chip package 0805, 1206 and SO packages
- define and recognize materials for printed board FR3 and FR4
- define and recognize thin and thick layer technology
- define and recognize chip assembly with bonding, with flip-chip technology

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

- JOSEF ŠANDERA, JIŘÍ STARÝ, Mikroelektronické praktikum, elektronický výukový text, umístěno na webu FEKT. (CS)
- J.ŠANDERA, Návrh plošných spojů pro povrchovou montáž, Technická literatura BEN, Praha 2006
- I. SZENDIUCH, Základy technologie mikroelektronických obvodů a systémů, VUTIUM Brno, 2006

Recommended reading

Not applicable.


Classification of course in study plans

  • Programme BKC-TLI Bachelor's, any year of study, winter semester, elective
  • Programme BKC-MET Bachelor's, 2. year of study, winter semester, compulsory

Type of course unit


Laboratory exercise

26 hours, compulsory

Teacher / Lecturer