Course detail
Modern Microelectronic Systems
FEKT-DPA-ME1Acad. year: 2022/2023
The subject is focused on the study of modern microelectronic components, systems and advanced technologies in the form of seminars and self-study activities. The student will obtain an overview of basic and advanced methods and techniques of scientific and engineering work and utilization of literature sources. He will be able to orientate in the field of modern microelectronics and components, the design of integrated circuits and microelectronic systems and the use of modern technologies in micro- and nanoelectronics.
Guarantor
Department
Learning outcomes of the course unit
Prerequisites
Co-requisites
Recommended optional programme components
Literature
Luryi, S., Xu, J., Zaslavsky, A.: Future Trends in Microelectronics [online]. Hoboken, NJ, USA: John Wiley & Sons, 2016 [cit. 2018-08-01]. ISBN 9781119069225. (EN)
Razavi, B.: Design of analog CMOS integrated circuits. Second edition. New York, NY: McGraw-Hill Education, [2017]. ISBN 9780072524932. (EN)
Pelgrom, M.J.M.: Analog-to-digital conversion. New York, NY: Springer Science+Business Media, 2016. ISBN 978-3-319-44970-8. (EN)
Monsurr`o, P., Pennisi, S., Scotti, G., Trifiletti, A.: Exploiting the Body of MOS Devices for High Performance Analog Design, IEEE Circuits and Systems Magazine, vol. 11, no. 4, pp. 8-23, 2011. DOI: 10.1109/MCAS.2011.942751 (EN)
STEPHAN, Karl David. Analog and mixed-signal electronics. Hoboken, New Jersey: John Wiley & Sons, [2015]. ISBN 978-1118782668. (EN)
Baranov, S., 2017. High Level Synthesis of Digital Systems: For Data Path and Control dominated systems, Print Replica. Print Replica. ISBN-13: 978-1-7750917-1-4 (EN)
Baranov, S., 2017. Finite State Machines and Algorithmic State Machines: Fast and Simple Design of Complex Finite State Machines. Print Replica. ISBN-13: 978-1-7750917-0-7 (EN)
Younes Shabany (2011). Heat Transfer: Thermal Management of Electronics. CRC Press. pp. 111–113. ISBN 978-1-4398-1468-0. (EN)
Johnson Wayne R. Electronic Packaging Approches dor Low/High Temperature Environments. In: Extreme Environment Electronics. Ed. by John D. Cressler and H. Alan Mantooth, pp. 765-790. ISBN: 978-1-4398-7430-1. (EN)
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
Language of instruction
Work placements
Course curriculum
2. System theory, system approach, systam analyssi and synthesisi
3. Theory of modelling
4. Modern electronic devices for microelectronics circuits and systems
5. New trends of devices for integrated circuits
6. Microelectronics technology - 3D chips, flexible circuits and substrates, mounting techniques, testing
7. - 8. Modern analog circuits
9. - 10. Modern digital circuits
11. New trends in mixed signal circuits design
12. Novel circuit pronciples and trends for integrated circuit design
13. Novel methods in microelectronics systems design and construction
Aims
Classification of course in study plans
- Programme DPA-KAM Doctoral, any year of study, winter semester, 4 credits, compulsory-optional
- Programme DPA-EKT Doctoral, any year of study, winter semester, 4 credits, compulsory-optional
- Programme DPA-EIT Doctoral, any year of study, winter semester, 4 credits, compulsory-optional
- Programme DPAD-EIT Doctoral, any year of study, winter semester, 4 credits, compulsory-optional
- Programme DPA-MET Doctoral, any year of study, winter semester, 4 credits, compulsory-optional
- Programme DPA-SEE Doctoral, any year of study, winter semester, 4 credits, compulsory-optional
- Programme DPA-TLI Doctoral, any year of study, winter semester, 4 credits, compulsory-optional
- Programme DPA-TEE Doctoral, any year of study, winter semester, 4 credits, compulsory-optional