Course detail
Selected Diagnostic Methods, Reliability and Quality
FEKT-DPA-ET2Acad. year: 2022/2023
Investigations of electrochemical power sources and related systems, potentiostat measurements. Methods for evaluation of activity and lifetime of electrode materials designed for electrochemical power sources.
Methods of scanning electron microscopy, interaction of electrons with solids, signals and their exploitation in diagnostics. Environmental scanning electron microscopy, study of non-conductive materials, phenomena on phase interfaces, dynamical in-situ experiments.
Electron spectroscopy, survey of electron spectroscopy methods. X-ray spectroscopy, energy and wave length dispersive methods.
Methods of X-ray diffractography, powder diffraction spectroscopy. Special diagnostics methods.
Defects of printed circuit boards, influence of material and process factors on their formation. Microscopic methods for defects diagnostics in printed circuit boards.
Reliability and quality, methods of reliability analysis. Quality control processes. Methods and procedures for risk assessment, risk management.
Guarantor
Offered to foreign students
Learning outcomes of the course unit
Prerequisites
Co-requisites
Recommended optional programme components
Literature
Reimer,L.: Scanning electron microscopy, Springer Verlag Berlin,1999. (EN)
Bard,A.J.:Electroanalytical Chemistry, Marcel Dekker,N.Y.,1970. (EN)
Brett,C.M.A.,Brett,A.M.O.: Electrochemistry, Oxford, 1993. (EN)
Kececioglu,D.: Maintainability, Availability and Operational Readiness Engineering Handbook, Vol.1. Prentice Hall, Englewood Cliffs, New Jersey, 1995. (EN)
Connor,D.J., Sexton,B.A., Smart,R.C.: Surface Analysis Methods in Materials Science, 2003. (EN)
Vickerman, J. C., Gilmore, I. Surface Analysis, Wiley, 2009 (EN)
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
Language of instruction
Work placements
Course curriculum
8. Methods of scanning electron microscopy, interaction of electrons with solids, interaction volume, signals and their exploitation in diagnostics.
9. Electron spectroscopy, overview and principles of electron spectroscopy methods. X-ray spectroscopy, energy and wave length dispersive methods.
10. Environmental scanning electron microscopy, study of non-conductive materials, investigation of phenomena on phase interfaces. Study of materials during dynamical in-situ experiments.
11. Methods of X-ray diffractography, powder diffraction spectroscopy. Special diagnostics methods.
12. Defects in soldered printed circuit boards, influence of material and process factors on their formation. Microscopic methods and techniques for defects diagnosis in printed circuit boards.
13. Reliability and quality, methods of reliability analysis. Quality control processes. Methods and procedures for risk assessment, risk management.
Aims
Classification of course in study plans
- Programme DPA-KAM Doctoral, any year of study, summer semester, 4 credits, compulsory-optional
- Programme DPA-EKT Doctoral, any year of study, summer semester, 4 credits, compulsory-optional
- Programme DPA-MET Doctoral, any year of study, summer semester, 4 credits, compulsory-optional
- Programme DPA-SEE Doctoral, any year of study, summer semester, 4 credits, compulsory-optional
- Programme DPA-TLI Doctoral, any year of study, summer semester, 4 credits, compulsory-optional
- Programme DPA-TEE Doctoral, any year of study, summer semester, 4 credits, compulsory-optional