Knowledge of selected methods used for determination of properties, parameters and structure of electrotechnic materials and material systems in relation to dependability and quality.

Knowlwedge on level of finished master study program at technical type university.

Not applicable.

Not applicable.

Van Zant,P.:Microchip Fabrication. McGraw-Hill New York, 2000. (EN)
Eckertová,L., Frank,L.: Elektronová mikroskopie a difrakce, Academia, Praha,1996. (CS)
Reimer,L.: Scanning electron microscopy, Springer Verlag Berlin,1999. (EN)
Frank,L., Král,J.: Metody analýzy povrchů, Academia, Praha, 2002. (CS)
Bard,A.J.:Electroanalytical Chemistry, Marcel Dekker,N.Y.,1970. (EN)
Brett,C.M.A.,Brett,A.M.O.: Electrochemistry, Oxford, 1993. (EN)
Kececioglu,D.: Maintainability, Availability and Operational Readiness Engineering Handbook, Vol.1. Prentice Hall, Englewood Cliffs, New Jersey, 1995. (EN)
Connor,D.J., Sexton,B.A., Smart,R.C.: Surface Analysis Methods in Materials Science, 2003. (EN)

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Written examination from individual parts.

Czech

Not applicable.

1.-7. Investigations of electrochemical power sources and related systems, potentiostat measurements. Methods for evaluation of activity and lifetime of electrode materials designed for electrochemical power sources.
8. Methods of scanning electron microscopy, interaction of electrons with solids, interaction volume, signals and their exploitation in diagnostics.
9. Electron spectroscopy, overview and principles of electron spectroscopy methods. X-ray spectroscopy, energy and wave length dispersive methods.
10. Environmental scanning electron microscopy, study of non-conductive materials, investigation of phenomena on phase interfaces. Study of materials during dynamical in-situ experiments.
11. Methods of X-ray diffractography, powder diffraction spectroscopy. Special diagnostics methods.
12. Defects in soldered printed circuit boards, influence of material and process factors on their formation. Microscopic methods and techniques for defects diagnosis in printed circuit boards.
13. Reliability and quality, methods of reliability analysis. Quality control processes. Methods and procedures for risk assessment, risk management.

The aim of the course is to acquaint students with selected methods for evaluation of properties, parameters and structure of some electrotechnic materials and material systems and with dependability, quality, and quality process management.

39 hours, optionally

eLearning: currently opened course