Course detail

Microelectronic technologies

FEKT-DME2Acad. year: 2017/2018

The subject is focused on a study of the microelectronic technologies using seminary and self-study. Students will take-up overview about elemental and advanced methods and techniques, material utilization, and rules for microstructure creation. They will know how to take bearings in areas of the design and fabrication, as well about utilization of nanotechnologies in microelectronics.

Language of instruction

Czech

Number of ECTS credits

Mode of study

Not applicable.

Guarantor

prof. Ing. Jaromír Hubálek, Ph.D.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

Preview of the mehods and techniques in thin-film and semicoductor technology, design skill of the microstructures and nanostructures using advanced techniques of fabrication.

Prerequisites

no

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

oral examine

Course curriculum

Elemental methods for the thin-film deposition, materials in the thin-film technology, topography design, lithography, anisotropic and isotropic etching of the microstructures, the thermal and chemical oxidation, anodization, impurity diffusion, passive layers, modern methods of the microstructure creation, MEMS, nanotechnology and nanoelectronics, NEMS.

Work placements

Not applicable.

Aims

Student is going to familiarize with the elemental and advanced methods and techniques for the microstructures and semiconductor devices fabrication, with materials, rules for their creation and modern nanotechnologies in semiconductor industry.

Specification of controlled education, way of implementation and compensation for absences

Not applicable.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Not applicable.

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme EKT-PK Doctoral

    branch PK-FEN , 1 year of study, summer semester, elective specialised
    branch PK-SEE , 1 year of study, summer semester, elective specialised
    branch PK-KAM , 1 year of study, summer semester, elective specialised
    branch PP-BEB , 1 year of study, summer semester, elective specialised
    branch PK-MVE , 1 year of study, summer semester, elective specialised
    branch PK-EST , 1 year of study, summer semester, elective specialised
    branch PK-TLI , 1 year of study, summer semester, elective specialised
    branch PK-TEE , 1 year of study, summer semester, elective specialised
    branch PK-MET , 1 year of study, summer semester, elective specialised

  • Programme EKT-PP Doctoral

    branch PP-TLI , 1 year of study, summer semester, elective specialised
    branch DP-TEE , 1 year of study, summer semester, elective specialised
    branch PP-SEE , 1 year of study, summer semester, elective specialised
    branch PP-KAM , 1 year of study, summer semester, elective specialised
    branch PP-BEB , 1 year of study, summer semester, elective specialised
    branch PP-MVE , 1 year of study, summer semester, elective specialised
    branch PP-EST , 1 year of study, summer semester, elective specialised
    branch PP-FEN , 1 year of study, summer semester, elective specialised
    branch PP-MET , 1 year of study, summer semester, elective specialised

Type of course unit

 

Seminar

39 hod., optionally

Teacher / Lecturer

prof. Ing. Jaromír Hubálek, Ph.D.

Syllabus

1 Úvod – výroba Si desek a bipolární technologie (On Semiconductor)
2 Základní metody nanášení tenkých vrstev
2.1 PVD (Physical Vapor Deposition) metody
2.2 CVD (Chemical Vapor Deposition) metody – redukce, oxidace nitridace, polymerace
3 Materiály
3.1 Targety
3.2 Prekurzory, sol-gel metoda
4 Pokročilé metody
4.1 Magnetronové naprašování – RF, reaktivní
4.2 Iontové naprašován
4.3 LPCVD (Low Pressure CVD)
4.4 PECVD (Plasma Enhanced CVD)
4.5 MOCVD (Metallo-Organic CVD)
4.6 ALD (Atomic Layer Deposition)
4.7 MBE (Molecular Beam Epitaxi)
5 Speciální metody
5.1 Termická a chemická oxidace
5.2 Galvanické pokovování
5.3 Anodizace
5.4 Spin- a dip-coating
5.5 Pasivace
5.6 Difúze látek v pevných materiálech – dopování příměsemi
6 Návrh topografie mikrosystémů, pravidla
7 Litografie
7.1 Elektronová litografie
7.2 Fotolitografie
8 Techniky leptání
8.1 Mokré – izotropní a anizotropní leptání
8.2 Suché – plasmové odprašování
9 Mikro a nanosystémy
9.1 MEMS (MicroElectroMechanical Systems)
9.2 NEMS (NanoElectroMechanical Systems
10 Moderní nanotechnologie a nanoelektronika
10.1 Samouspořádací proces – uhlíkové nanotrubky, anodizované nanopóry
10.2 65 a 45 nm technologie DIO – tri-gate tranzistor
10.3 Molekulární elektronika