Course detail
New technology for microelectronic circuits
FEKT-MMTEAcad. year: 2012/2013
Subject dealing with basic principles of the modern electronic technologies that are used for electronic hardware. The Impact is put on integration principles for the construction of new circuits, equipments and systems.
One of the basic aims of this subject is to understanding technology integration of modern electronic products, in the whole life cycle, including their design and assembly.
This matter is composited from managing position to give base for leadin positions. That is reason why are included also some parts about quality and environment managment.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Department
Learning outcomes of the course unit
Prerequisites
Co-requisites
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
Course curriculum
Work placements
Aims
Specification of controlled education, way of implementation and compensation for absences
Recommended optional programme components
Prerequisites and corequisites
Basic literature
Recommended reading
Classification of course in study plans
- Programme EEKR-M Master's
branch M-MEL , 2 year of study, summer semester, elective specialised
branch M-EST , 1 year of study, summer semester, elective interdisciplinary - Programme EEKR-M Master's
branch M-MEL , 2 year of study, summer semester, elective specialised
branch M-EST , 1 year of study, summer semester, elective interdisciplinary - Programme EEKR-CZV lifelong learning
branch EE-FLE , 1 year of study, summer semester, elective specialised
Type of course unit
Lecture
Teacher / Lecturer
Syllabus
Semiconductor chips and their assembly
Hybrid integrated circuits
Non conventional applications of TF
New trends in assembly technologies / LTCC
SMD's
MCM
Flip chip, CSP, 3D packages
SMT I - design, solder paste deposition, placement
Soldering - reflow vs. flow
SPC
TQM
Certification and ISO vs, EN, CE
Laboratory exercise
Teacher / Lecturer
Syllabus
Interactive design of HIC
Screen printing and Thick Film firing
Chip assembly and ultrasonic bonding
SMD practical application, testing and packaging
Repair and rework
Assembly of Fine Pitch components
Thick film sensors
Informatic system for control of production