Course detail
Interconnection and assembly technolology
FEKT-MMOTAcad. year: 2012/2013
Interconnection techniques, methods, properties. Levels of interconnection. Organic and inorganic substrates. Technology steps in interconnection structures production. Microvia.
Technology of assemled interconnection structures. Surface Mount Technology (SMT). Types of package and basic of manipulation. Solder pastes, fluxes, conformal coatings and their application.
Types of adhesives, technology of adhesive joint realisation. Soldering processes and technology of soldering. Strategy of testing.
Defects in interconnection structures and their causes.
Optimization of production process
Language of instruction
Czech
Number of ECTS credits
4
Mode of study
Not applicable.
Guarantor
Learning outcomes of the course unit
Students will be able to:
Define basic principles from assembly and inteconnection techniques, explain levels of interconnection.
Describe sorts and explain methods of assembled joint realisation. Describe and explain factors influencing quality of assembled joint.
Explain technology procedure of multilayer PCB with microvia. Describe and explain individual production step.
Explain mechanism of adhesion joint, properties and types of physically hardened and chemically cured adhesives.
Explain mechanism of solder joint, solder joint requirements, soldering techniques, diferences between tin/lead and lead free solder joint. Explain chemistry and cleaning techniques of PCBś and assembled PCBś.
Define basic principles from assembly and inteconnection techniques, explain levels of interconnection.
Describe sorts and explain methods of assembled joint realisation. Describe and explain factors influencing quality of assembled joint.
Explain technology procedure of multilayer PCB with microvia. Describe and explain individual production step.
Explain mechanism of adhesion joint, properties and types of physically hardened and chemically cured adhesives.
Explain mechanism of solder joint, solder joint requirements, soldering techniques, diferences between tin/lead and lead free solder joint. Explain chemistry and cleaning techniques of PCBś and assembled PCBś.
Prerequisites
The subject knowledge on the Bachelor´s degree level is requested.
Co-requisites
Not applicable.
Planned learning activities and teaching methods
Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.
Assesment methods and criteria linked to learning outcomes
Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every year. Evaluatin of laboratory works, test, final written and oral examination.
Course curriculum
1. Interconnection techniques, methods, properties. Levels of interconnection. Base materials for Printed Circuit Boards (PCBś) production, organic, inorganic, reinforcements, resins, copper clad materials. Base materials organic rigid, flexible, rigid/flexible, semiflexible. Properties: electrical, mechanical, thermal, chemical. Standard ČSN EN 61249 – xx – xx. Organic base materials, properties. Base materials inorganic, comparison with organic. Requirements for base materials, latest trends and development in base materials area. MID.
2. Interconnection structures, types. Subtractive, semiaditive and aditive methods of production interconnecton structures. PCBś production - main orientation. Base steps in PCBś production. Technology procedure of single, double and multilayer PCB.
3. Interconnection structures with microvia, SBU methods. PCBś assembly - through hole technology (THT) and surface mount technology (SMT), mixed. Technology procedures. Latest trends in SMT.
4. "Chemistry in assembly" and correct application in process /solder paste, solder alloy, flux, adhesive, conformal coating, packaging material/
5. Interconnection 1-st level, bonding techniques, packaging. (Szendiuch/Starý 2 hrs)
6. Surface mount devices (SMDś), packages, properties, type of leads, IC packages, passive components, elektromechanical devices, BGA packages, construction. (Šandera) (2 hrs.)
7. Adhesives I. Adhesion and cohession. Physically hardened and chemically cured adhesives.
8. Adhesives II Application techniques, screen/stencil printing, dispensing/. Basic for quality in printing, factors.
9. Soldering, solder joint, requirements for solder joint. Soldered joint vs. welded joint vs. joint realised with adhesive - comparison. Methods of soldering. Requirements for quality of placement and soldering acc. to IPC A 610 rev. E. (Starý) (2 hod.)
10. Solder joint reliability. Lead free vs. lead soldering. Wave soldering (mass), nitrogen atmosphere infuence. Manual soldering, principles, soldering tips maintenance. Reflow soldering, methods, forced convection and nitrogen atmosphere influence.Temperature profile measurememts. Thermal management of PCB.
11. Cleaning techniques. Cleaning medias, microemulsion. PCB contamination, measuring. Flux residues and defects.
12. Mechanically realised connections, types, properties.
13. Quality control, methods. Testing of assembled and non-assembled PCBś. Automatic Optical Inspection (AOI). SPI. Statistical tools for quality testing and improvement. (Starý) (2 hrs.)
2. Interconnection structures, types. Subtractive, semiaditive and aditive methods of production interconnecton structures. PCBś production - main orientation. Base steps in PCBś production. Technology procedure of single, double and multilayer PCB.
3. Interconnection structures with microvia, SBU methods. PCBś assembly - through hole technology (THT) and surface mount technology (SMT), mixed. Technology procedures. Latest trends in SMT.
4. "Chemistry in assembly" and correct application in process /solder paste, solder alloy, flux, adhesive, conformal coating, packaging material/
5. Interconnection 1-st level, bonding techniques, packaging. (Szendiuch/Starý 2 hrs)
6. Surface mount devices (SMDś), packages, properties, type of leads, IC packages, passive components, elektromechanical devices, BGA packages, construction. (Šandera) (2 hrs.)
7. Adhesives I. Adhesion and cohession. Physically hardened and chemically cured adhesives.
8. Adhesives II Application techniques, screen/stencil printing, dispensing/. Basic for quality in printing, factors.
9. Soldering, solder joint, requirements for solder joint. Soldered joint vs. welded joint vs. joint realised with adhesive - comparison. Methods of soldering. Requirements for quality of placement and soldering acc. to IPC A 610 rev. E. (Starý) (2 hod.)
10. Solder joint reliability. Lead free vs. lead soldering. Wave soldering (mass), nitrogen atmosphere infuence. Manual soldering, principles, soldering tips maintenance. Reflow soldering, methods, forced convection and nitrogen atmosphere influence.Temperature profile measurememts. Thermal management of PCB.
11. Cleaning techniques. Cleaning medias, microemulsion. PCB contamination, measuring. Flux residues and defects.
12. Mechanically realised connections, types, properties.
13. Quality control, methods. Testing of assembled and non-assembled PCBś. Automatic Optical Inspection (AOI). SPI. Statistical tools for quality testing and improvement. (Starý) (2 hrs.)
Work placements
Not applicable.
Aims
The aim of the subject is to make students familiar with the problems of Printed Circuit Boards (PCB).
Knowlodges espec. from SMT will be on higher level. Students will have practically closer view for individul factors in each operationand their influence for production process quality
Knowlodges espec. from SMT will be on higher level. Students will have practically closer view for individul factors in each operationand their influence for production process quality
Specification of controlled education, way of implementation and compensation for absences
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.
Recommended optional programme components
Not applicable.
Prerequisites and corequisites
Not applicable.
Basic literature
Lea, C.:A Scientific Guide to Surface Mount Technology, Electrochemical Publications Ltd, GB 1998 (EN)
Normy ANSI/IPC-A-610 rev. E, rev F, The Institute for Electronic and Packaging Electronic Circuits, USA, ANSI/IPC-CM-770C a ANSI/IPC-SM-782 a normy ČSN EN dle doporučení (CS)
Starý,J.,Šandera,J.,Kahle P.:Plošné spoje a povrchová montáž, PC DIR-REAL Brno, 1999 (CS)
Wassink, R. J. K.:Manufacturing Techniques for Surface Mounted Assemblies,Electrochemical Publications Ltd, GB 1995 (EN)
Normy ANSI/IPC-A-610 rev. E, rev F, The Institute for Electronic and Packaging Electronic Circuits, USA, ANSI/IPC-CM-770C a ANSI/IPC-SM-782 a normy ČSN EN dle doporučení (CS)
Starý,J.,Šandera,J.,Kahle P.:Plošné spoje a povrchová montáž, PC DIR-REAL Brno, 1999 (CS)
Wassink, R. J. K.:Manufacturing Techniques for Surface Mounted Assemblies,Electrochemical Publications Ltd, GB 1995 (EN)
Recommended reading
Hwang, J., S.:Environment-Friendly Electronics: Lead Free Technology, Electrochemical Publications Limited 2001, ISBN 0 901150 401 (EN)
Classification of course in study plans
- Programme EEKR-M Master's
branch M-MEL , 1 year of study, summer semester, elective specialised
branch M-EVM , 1 year of study, summer semester, compulsory - Programme EEKR-M Master's
branch M-MEL , 1 year of study, summer semester, elective specialised
branch M-EVM , 1 year of study, summer semester, compulsory - Programme EEKR-CZV lifelong learning
branch EE-FLE , 1 year of study, summer semester, compulsory
Type of course unit
Lecture
26 hod., optionally
Teacher / Lecturer
Syllabus
Organic substrates, reinforcement and resin, metal glad base material. Inorganic substrates
Organic base materials, electrical, mechanical and temperature properties. Trends in base materialsand requiremence. Inorganic base materials, their properties and comparison with organic ones.
Interconnection structures, sorting. Subtractive, semiadditive and additive methods. Trends
Technology procedures of single-layer, double layer and multi-layer PCB, Molded interconnect devices (MID). Microvia. Technology possibilities and trend.
Through Hole Technology (THT), Surface Mounted Technology (SMT) and combined THT and SMT. Technology procedures. Trend in SMT.
Solder pastes. solder alloys, adhesives, fluxes, conformal coatings and encapsulants
Application technology /screen and stencil printing, dispense/. Population of SMD, pick and place machines, principles, methods of component centering.
Surface Mounted Devices (SMD), properties and packaging, component leads, IC packages, passive components, electromechanical devices, Ball Grid Array (BGA), construction.
Soldering, methds of soldering, solder joint and solder joint reliability. Vawe soldering techniques, nitrogen atmosphere influence. Manual soldering, principles. <>Reflow soldering, methods, forced concection and nitrogen atmosphere influence. Temperature profiling. Strategy of testing. Testing of assembled and non assembled PCB. Quality control. Methods.
PCB repairs, contact and contactless methods for components disassembly and assembly. Principles and techniques for repairing. Requirements for PCB according třo IPC and Czech standards, Electrostatic Discharge (ESD)
Reliability in assembly process ond main factors.
Defects in interconnection structures and their causes.
Organic base materials, electrical, mechanical and temperature properties. Trends in base materialsand requiremence. Inorganic base materials, their properties and comparison with organic ones.
Interconnection structures, sorting. Subtractive, semiadditive and additive methods. Trends
Technology procedures of single-layer, double layer and multi-layer PCB, Molded interconnect devices (MID). Microvia. Technology possibilities and trend.
Through Hole Technology (THT), Surface Mounted Technology (SMT) and combined THT and SMT. Technology procedures. Trend in SMT.
Solder pastes. solder alloys, adhesives, fluxes, conformal coatings and encapsulants
Application technology /screen and stencil printing, dispense/. Population of SMD, pick and place machines, principles, methods of component centering.
Surface Mounted Devices (SMD), properties and packaging, component leads, IC packages, passive components, electromechanical devices, Ball Grid Array (BGA), construction.
Soldering, methds of soldering, solder joint and solder joint reliability. Vawe soldering techniques, nitrogen atmosphere influence. Manual soldering, principles. <>Reflow soldering, methods, forced concection and nitrogen atmosphere influence. Temperature profiling. Strategy of testing. Testing of assembled and non assembled PCB. Quality control. Methods.
PCB repairs, contact and contactless methods for components disassembly and assembly. Principles and techniques for repairing. Requirements for PCB according třo IPC and Czech standards, Electrostatic Discharge (ESD)
Reliability in assembly process ond main factors.
Defects in interconnection structures and their causes.
Laboratory exercise
8 hod., optionally
Teacher / Lecturer
Syllabus
Prototype production process of single - layer PCB in BUNGARD/PROTOCAD line
Prototype production process of double - layer PCB in BUNGARD/PROTOCAD line
Surface Mount Technology - printing/dispensing of solder paste/adhesive, program preparing for semiautomatic machine, pick and place with semiautomatic machine, reflow soldering, quality control
Requirements for quality of SMD placement and soldering
Contact/contactless method for assembly/disassembly SMD
Types of packages, component marking, ESD (interactive PC educational program) <>
Prototype production process of double - layer PCB in BUNGARD/PROTOCAD line
Surface Mount Technology - printing/dispensing of solder paste/adhesive, program preparing for semiautomatic machine, pick and place with semiautomatic machine, reflow soldering, quality control
Requirements for quality of SMD placement and soldering
Contact/contactless method for assembly/disassembly SMD
Types of packages, component marking, ESD (interactive PC educational program) <>