Course detail
Diagnostics and Testing
FEKT-KDIZAcad. year: 2012/2013
Fundamental concepts and methods in diagnostics.
Electrical, mechanical testing of materials and devices. Tests of climatic resistance.Destructive and non destructive testing. Microscopic, spectroscopic and diffractomectric methods - principles and usage. Evaluation and verification of diagnostics analyses. Diagnostics and testing, technical demands on products, responsibility for defect products. Principles and organization of testing stations in Czech Rep., testing in laws of Czech Rep.
Language of instruction
Czech
Number of ECTS credits
5
Mode of study
Not applicable.
Guarantor
Learning outcomes of the course unit
Students will receive a survey about problems connected with diagnostics of electrical materials and devices, about principles and organization of testing in Czech Rep. Students will be acquaint with tests which are obligatory at introducing a new electrical product to market. In practise they will be able to suggest a suitable diagnostic method for solving of a concrete diagnostic problem.
Prerequisites
Not applicable.
Co-requisites
Not applicable.
Planned learning activities and teaching methods
Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.
Assesment methods and criteria linked to learning outcomes
Requirements for accreditation:
Active participation in seminars. Development, delivery and presentation of term paper.
Final written exam.
Active participation in seminars. Development, delivery and presentation of term paper.
Final written exam.
Course curriculum
1) Fundamental concepts of technical diagnostics, survey of methods. Tecnical diagnostics in practise. Selection of a method of technical diagnostics.
2) Electrical measuring methods in diagnostics of semiconductor materials and structures. Methods for setting of concentration and concentration profiles of dopants.
3) DC and AC measuring methods in diagnostics of insulator systems. HV tests, evaluation of tests.
4) Safety tests of electrical devices. Climatic tests, mechanical tests of electrical devices and equipments.
5) Tests of mechanical properties - survey of methods. Hardness tests. Methods of acoustic and electromagnetic diagnostics.
6) Diagnostics and testing. Obligations of producers, importers and distributors at introducing of products to market. Conformity assesment of products.
7) Physical methods for setting of structure and composition of materials, material systems and structures. Methods based on scanning probe, secondary ion mass spectroscopy (SIMS). Sensitivity and resolution of methods.
8) Survey of methods of optical microscopy. Methods for measurement of thin layer thickness.
9) Scanning and transmission electron microscopy. Diagnostics on bases of detection of individual signals.
10) Special methods of scanning electron microscopy. Voltage contrast, magnetic contrast, EBIC, low energy and low vacuum electron microscopy.
11) Diffraction methods. X-ray diffraction, electron and neutron diffraction methods.
12) Spectroscopy methods, atom and molecule spectroscopy. Absorption, emission, X-ray and electron spectroscopy. Mass spectroscopy.
13) Evaluation of results of a measurement. Measurement errors, parameters of accuracy.
2) Electrical measuring methods in diagnostics of semiconductor materials and structures. Methods for setting of concentration and concentration profiles of dopants.
3) DC and AC measuring methods in diagnostics of insulator systems. HV tests, evaluation of tests.
4) Safety tests of electrical devices. Climatic tests, mechanical tests of electrical devices and equipments.
5) Tests of mechanical properties - survey of methods. Hardness tests. Methods of acoustic and electromagnetic diagnostics.
6) Diagnostics and testing. Obligations of producers, importers and distributors at introducing of products to market. Conformity assesment of products.
7) Physical methods for setting of structure and composition of materials, material systems and structures. Methods based on scanning probe, secondary ion mass spectroscopy (SIMS). Sensitivity and resolution of methods.
8) Survey of methods of optical microscopy. Methods for measurement of thin layer thickness.
9) Scanning and transmission electron microscopy. Diagnostics on bases of detection of individual signals.
10) Special methods of scanning electron microscopy. Voltage contrast, magnetic contrast, EBIC, low energy and low vacuum electron microscopy.
11) Diffraction methods. X-ray diffraction, electron and neutron diffraction methods.
12) Spectroscopy methods, atom and molecule spectroscopy. Absorption, emission, X-ray and electron spectroscopy. Mass spectroscopy.
13) Evaluation of results of a measurement. Measurement errors, parameters of accuracy.
Work placements
Not applicable.
Aims
The aim of the course is to acquaint students with basic concepts and methods from the field of diagnostic of electrical materials and devices, with principles and organization of testing stations in Czech Rep. Students will be familiar with electrical and mechanical tests, safety tests and tests of climatic resistance. Students will receive essential information about physical methods for evaluation of a structure and composition of observed subjects.
Specification of controlled education, way of implementation and compensation for absences
Obligatory participation in teaching.
Recommended optional programme components
Not applicable.
Prerequisites and corequisites
Not applicable.
Basic literature
Frank,L.,Král,J.: Metody analýzy povrchů. Iontové, sondové a speciální metody. Academia, Praha, 2002 (CS)
Jirák, J., Havlíček, S., Rozsívalová, Z.: Diagnostika a zkušebnictví. Elektronické texty, Brno 2002. (CS)
Jirák, J., Havlíček, S., Rozsívalová, Z.: Diagnostika a zkušebnictví. Elektronické texty, Brno 2002. (CS)
Recommended reading
Koblížek,V. Měření a kontrola v elektrotechnologii ČVUT Praha,1991. (CS)
Reimer,L.:Scanning electron microscopy,Springer Verlag Berlin,2005 (EN)
Reimer,L.:Scanning electron microscopy,Springer Verlag Berlin,2005 (EN)
Classification of course in study plans
Type of course unit
Lecture
26 hod., optionally
Teacher / Lecturer
Syllabus
1) Fundamental concepts of technical diagnostics, survey of methods. Tecnical diagnostics in practise. Selection of a method of technical diagnostics.
2) Electrical measuring methods in diagnostics of semiconductor materials and structures. Methods for setting of concentration and concentration profiles of dopants.
3) DC and AC measuring methods in diagnostics of insulator systems. HV tests, evaluation of tests.
4) Safety tests of electrical devices. Climatic tests, mechanical tests of electrical devices and equipments.
5) Tests of mechanical properties - survey of methods. Hardness tests. Methods of acoustic and electromagnetic diagnostics.
6) Diagnostics and testing. Obligations of producers, importers and distributors at introducing of products to market. Conformity assesment of products.
7) Physical methods for setting of structure and composition of materials, material systems and structures. Methods based on scanning probe, secondary ion mass spectroscopy (SIMS). Sensitivity and resolution of methods.
8) Survey of methods of optical microscopy. Methods for measurement of thin layer thickness.
9) Scanning and transmission electron microscopy. Diagnostics on bases of detection of individual signals.
10) Special methods of scanning electron microscopy. Voltage contrast, magnetic contrast, EBIC, low energy and low vacuum electron microscopy.
11) Diffraction methods. X-ray diffraction, electron and neutron diffraction methods.
12) Spectroscopy methods, atom and molecule spectroscopy. Absorption, emission, X-ray and electron spectroscopy. Mass spectroscopy.
13) Evaluation of results of a measurement. Measurement errors, parameters of accuracy.
2) Electrical measuring methods in diagnostics of semiconductor materials and structures. Methods for setting of concentration and concentration profiles of dopants.
3) DC and AC measuring methods in diagnostics of insulator systems. HV tests, evaluation of tests.
4) Safety tests of electrical devices. Climatic tests, mechanical tests of electrical devices and equipments.
5) Tests of mechanical properties - survey of methods. Hardness tests. Methods of acoustic and electromagnetic diagnostics.
6) Diagnostics and testing. Obligations of producers, importers and distributors at introducing of products to market. Conformity assesment of products.
7) Physical methods for setting of structure and composition of materials, material systems and structures. Methods based on scanning probe, secondary ion mass spectroscopy (SIMS). Sensitivity and resolution of methods.
8) Survey of methods of optical microscopy. Methods for measurement of thin layer thickness.
9) Scanning and transmission electron microscopy. Diagnostics on bases of detection of individual signals.
10) Special methods of scanning electron microscopy. Voltage contrast, magnetic contrast, EBIC, low energy and low vacuum electron microscopy.
11) Diffraction methods. X-ray diffraction, electron and neutron diffraction methods.
12) Spectroscopy methods, atom and molecule spectroscopy. Absorption, emission, X-ray and electron spectroscopy. Mass spectroscopy.
13) Evaluation of results of a measurement. Measurement errors, parameters of accuracy.
Laboratory exercise
26 hod., compulsory
Teacher / Lecturer
Syllabus
DC methods in diagnostics of electroinsulating systems.
AC methods in diagnostics of electroinsulating systems.
Work at HV laboratory. HV testing. 2 weeks.
Safety tests of electrical devices. Tests of climatic resistance of electrical devices.
Measuring on semiconductor materials. Methods for evaluation of concetration of acceptor and donor impurities. 2 weeks.
Tests of mechanical properties. Hardness tests. 2 weeks.
Work with optical microscope, its usage.
Work with transmission electron microscope.
Work with scanning electron microscope.
X ray microanalysis with energy dispersive microanalyzer.
AC methods in diagnostics of electroinsulating systems.
Work at HV laboratory. HV testing. 2 weeks.
Safety tests of electrical devices. Tests of climatic resistance of electrical devices.
Measuring on semiconductor materials. Methods for evaluation of concetration of acceptor and donor impurities. 2 weeks.
Tests of mechanical properties. Hardness tests. 2 weeks.
Work with optical microscope, its usage.
Work with transmission electron microscope.
Work with scanning electron microscope.
X ray microanalysis with energy dispersive microanalyzer.